SOLID STATE LIGHT UNIT AND HEAT SINK, AND METHOD FOR THERMAL MANAGEMENT OF A SOLID STATE LIGHT UNIT

• US 20100315813A1
• Filed: 01/11/2010
• Published: 12/16/2010
• Est. Priority Date: 07/12/2007
• Status: Active Grant

• Current Assignee: Sunovia Energy Technologies, Inc.
• Original Assignee: Sunovia Energy Technologies, Inc.
• Inventors: Fitzgerald, Lisa Marie, Fugerer, Robert, Smith, Carl III
• Granted Patent: US 8,220,977 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 15/015 Devices for covering joints between adjacent lighting devices; End coverings
• CPC Class Codes: F21V 19/004 by deformation of parts or snap action mountings, e.g. using clips
• CPC Class Codes: F21V 23/026 Fastening of transformers or ballasts
• CPC Class Codes: F21V 23/0442 activated by means of a sensor, e.g. motion or photodetectors
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 7/18 with provision for folding or collapsing
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A lamp assembly manages thermal energy output from solid state lighting elements. An aspect of the present disclosure provides a lamp assembly that achieves enhanced cooling of light elements within the assembly. Enhanced cooling is achieved, in this aspect, by providing a lamp assembly including a heat sink having a plurality of thermo bosses protruding therefrom on a first side, and a plurality of heat sink fins on a second side. A printed circuit board is secured to the first side of the heat sink, and has a plurality of through holes that correspond to the size and locations of the thermo bosses, such that when the printed circuit board is secured to the heat sink, the thermo bosses extend into the through holes.

Claims

1. A solid state lamp assembly comprising:

a heat sink comprising a heat dissipating surface and a heat collecting surface, the heat collecting surface having one or more thermo bosses protruding therefrom;

a printed circuit board having at least one through hole and a light element mounting area located adjacent to the through hole, the printed circuit board mounted in the lamp assembly adjacent to the heat sink such that the thermo boss extends into the through hole; and

at least one solid state lighting element mounted to the printed circuit board at the mounting area, at least a portion of the solid state lighting element covering the through hole such that the solid state lighting element contacts the thermo boss.

2. The lamp assembly of claim 1, further comprising a biasing member interconnected to the heat sink with the printed circuit board located between the biasing member and the heat sink, whereby the biasing member asserts pressure against the printed circuit board to pressure the solid state light element against the thermo boss.

3. The lamp assembly of claim 2, wherein the biasing member comprises a spring that is secured to the lamp assembly and provides pressure along a length of the printed circuit board against the heat sink.

4. The lamp assembly of claim 2, wherein the biasing member substantially surrounds the solid state light element.

5. The lamp assembly of claim 1, further comprising a lens interconnected with the heat sink and printed circuit board that scatters light produced by the solid state light elements.

6. The lamp assembly of claim 1, further comprising a mounting bracket that is interconnected with the heat sink and printed circuit board providing a mounting point for the lamp assembly.

7. The lamp assembly of claim 6, wherein the mounting bracket interconnects with a flange on the heat sink to provide a hinge that holds the lamp assembly at a convenient angle for interconnecting a power supply of the lamp assembly to a power source.

8. The lamp assembly of claim 1, further comprising a retaining spring that presses against a ring formed on one or more solid state light elements and enhances the contact between the back side of the light element and the thermo boss.

9. The lamp assembly of claim 8, wherein the retaining spring comprises a reflective surface on the opposite side of the retaining spring that reflects light to a lens of the lamp assembly.

10. The lamp assembly of claim 1, wherein the heat sink, printed circuit board, and light element are mounted to a housing, and further comprising a power supply attached to the housing that provides power to the printed circuit board and light elements.

11. The lamp assembly of claim 10, wherein the power supply is interconnected to an external power supply and has an internal battery or other power supply that is used to provide power to the PCB and light element in the event that the external power supply is not available.

12. The lamp assembly of claim 1, wherein the at least one solid state light element comprises a light emitting diode.

13. A method for managing thermal output of a solid state lamp assembly, comprising:

providing a mounting substrate with at least one through hole corresponding to a location where at least one solid state light element is mounted to the substrate;

interconnecting the mounting substrate to a heat sink assembly, the heat sink assembly comprising at least one boss that protracts from the heat sink and extends into an associated through hole of the mounting substrate; and

contacting the at least one thermo boss to an associated at least one solid state light element to create a thermal path to conduct heat away from the associated solid state light element.

14. The method of claim 13, further comprising securing the heat sink to the mounting substrate with a retaining spring.

15. The method of claim 13, further comprising interconnecting optical elements with the lamp assembly.

16. The method of claim 15, wherein the optical elements comprise at least one of reflectors, lenses, and diffusers.

17. The method of claim 13, wherein the at least one solid state light element comprises a light emitting diode.