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MULTI-STATION DEPOSITION APPARATUS AND METHOD

  • US 20100316800A1
  • Filed: 08/20/2010
  • Published: 12/16/2010
  • Est. Priority Date: 04/16/2002
  • Status: Active Grant
First Claim
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1. An apparatus for depositing material on a wafer, comprising:

  • a vacuum deposition chamber;

    a substrate support adapted for supporting a substrate in at least a first deposition position and a second deposition position within the vacuum deposition chamber;

    a plurality of gas curtain distributors disposed within the vacuum deposition chamber, a first gas curtain distributor fixed in a position relative to the substrate support; and

    a gas dispensing system, disposed within the vacuum deposition chamber and having one or more gas dispensing nozzles aligned with the first deposition position and a second deposition position.

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