METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD
First Claim
1. A method for manufacturing a liquid discharge head including a silicon substrate having one surface, energy generation elements for generating energy used for discharging a liquid being provided at side of the one surface, and a supply port which is provided so as to penetrate through the one surface of the silicon substrate and a reverse surface of the one surface for supplying the liquid to the energy generation elements, the method comprising:
- providing a first layer containing a metal nitride to at least a portion on the one surface of the silicon substrate corresponding to the supply port;
providing a second layer on the first layer, the second layer comprising any one of aluminum, copper, and gold, or an alloy thereof;
etching a portion of the silicon substrate corresponding to the supply port by reactive ion etching in a direction from the reverse surface towards the one surface so that the etched region reaches the first layer; and
removing a portion of the first layer corresponding to the supply port and then removing a portion of the second layer corresponding to the supply port, thus forming the supply port.
1 Assignment
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Accused Products
Abstract
A method for manufacturing a liquid discharge head includes providing a first layer containing a metal nitride to at least a portion on one surface of a silicon substrate corresponding to a supply port; providing a second layer on the first layer, the second layer including any one of aluminum, copper, and gold, or an alloy thereof; etching a portion of the silicon substrate corresponding to the supply port by reactive ion etching in a direction from the reverse surface towards the one surface so that the etched region reaches the first layer; and removing a portion of the first layer corresponding to the supply port and then removing a portion of the second layer corresponding to the supply port, thus forming the supply port.
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Citations
5 Claims
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1. A method for manufacturing a liquid discharge head including a silicon substrate having one surface, energy generation elements for generating energy used for discharging a liquid being provided at side of the one surface, and a supply port which is provided so as to penetrate through the one surface of the silicon substrate and a reverse surface of the one surface for supplying the liquid to the energy generation elements, the method comprising:
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providing a first layer containing a metal nitride to at least a portion on the one surface of the silicon substrate corresponding to the supply port; providing a second layer on the first layer, the second layer comprising any one of aluminum, copper, and gold, or an alloy thereof; etching a portion of the silicon substrate corresponding to the supply port by reactive ion etching in a direction from the reverse surface towards the one surface so that the etched region reaches the first layer; and removing a portion of the first layer corresponding to the supply port and then removing a portion of the second layer corresponding to the supply port, thus forming the supply port. - View Dependent Claims (2, 3, 4, 5)
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Specification