Sensor configuration without housing

• US 20100319470A1
• Filed: 06/16/2010
• Published: 12/23/2010
• Est. Priority Date: 06/19/2009
• Status: Abandoned Application

• Current Assignee: Baumer Innotec AG
• Original Assignee: Baumer Innotec AG
• Inventors: Wehrle, Wolfgang, Juergens, Alexander
• Application Number:
  US12/816,791
• Publication Number:
  US 20100319470A1
• Time in Patent Office: Days
• US Class Current: 73/866.1
• CPC Class Codes: H05K 2201/09872 Insulating conformal coating foil encapsulation H05K2203/1311
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Abstract

The present invention relates to a method for manufacturing a housing-less sensor, in particular a proximity sensor. Here it is proposed to build all of the components needed for the mechanical and electrical functions on one sensor chassis and then to inject a plastic compound around the components.

Claims

1. A method for the production of at least one sensor, wherein through the at least partial injection molding of a plastic compound around components that comprise optical, electronic, mechanical, and/or hybrid components, but at least one transducer, an polygonal molded body is formed whose outer dimensions correspond to the inner dimensions of an injection mold,

characterized by:

mechanically fixing the components before the injection molding on a top side and/or back side of at least one printed circuit board;

placing the at least one printed circuit board equipped with the components into the injection mold;

holding the at least one printed circuit board in the injection mold in a defined position relative to the walls of the injection mold by means of support fingers; and

injection molding the at least one printed circuit board with the components in the defined position.

2. The method according to claim 1, wherein the components are placed, pressed, clipped, adhered, or soldered onto the printed circuit board.

3. The method according to claim 1, wherein, as a transducer, a preassembled, hybrid-integrated component i) is fixed mechanically on the printed circuit board, ii) comprises the optical, electronic, and/or mechanical component and iii) is at least partially injection molded.

5. The method according to claim 1, wherein, as a transducer, the sensor comprises an optoelectronic component fixed mechanically on the printed circuit board, as well as a preassembled lens unit with a lens carrier and at least one lens, wherein the lens carrier is placed in a groove of the printed circuit board and in the injection mold and is at least partially injection molded.

6. The method according to claim 1, wherein the mechanical components comprise at least one attachment element that is injection molded at least partially with the plastic, so that a mechanically rigid connection to the molded body is formed.

7. The method according to claim 1, wherein the printed circuit board is assembled with multiple identical printed circuit boards to form a printed circuit board panel, the printed circuit boards in the printed circuit board panel are placed in the injection mold and injection molded, and after the injection molding, the encapsulated printed circuit boards are separated from the printed circuit board panel.

8. The method according to claim 1, wherein a transparent or semitransparent plastic is used as the plastic compound.

9. A sensor manufactured according to the method of claim 1, wherein the sensor comprises a printed circuit board on whose top side and/or back side, at least one optical, mechanical, electronic, and/or hybrid-integrated component is mounted, wherein the printed circuit board and the components are at least partially surrounded by a molded body made from plastic.

10. The sensor according to claim 9, wherein the components comprise at least one transducer that is constructed as an electronic, mechanical, and/or hybrid-integrated component.

11. The sensor according to claim 9, further comprising a duct element that is embedded in the plastic compound and that forms a duct in the plastic compound, and wherein the transducer is arranged in the duct.

12. The sensor according to claim 9, wherein the components comprise an optical transducer with an optoelectronic component, as well as a lens unit extending above the optoelectronic component and including a lens carrier and at least one lens.

13. The sensor according to claim 9, wherein at least one mechanical component is constructed on the printed circuit board as an attachment element.

14. The sensor according to claim 9, wherein additional alignment pins are provided on the molded body for the exact positioning of the sensor.

15. The sensor according to claim 13, wherein the attachment element comprises a threaded insert or a threaded sleeve.

16. The sensor according to claim 15, wherein an electrical connection is guided through the threaded sleeve.

17. The sensor according to claim 9, wherein the molded body is made from a transparent or semi-transparent plastic and a light-emitting diode is provided on the printed circuit board.

4. The method according to claim 4, further comprising mounting a duct element on the printed circuit board before the injection molding with the plastic compound, so that, in a top view of the printed circuit board, a duct wall surrounds the transducer, so that, after the injection molding, the plastic compound surrounds a duct formed by the duct element.