SOLDER CONNECTION ELEMENT

• US 20100319977A1
• Filed: 12/05/2008
• Published: 12/23/2010
• Est. Priority Date: 12/11/2007
• Status: Active Grant

• Current Assignee: Saint-Gobain Glass France (Compagnie De Saint-Gobain)
• Original Assignee: Saint-Gobain Glass France (Compagnie De Saint-Gobain)
• Inventors: Rateiczak, Mitja, Reul, Bernhard, Retsch, Cornelia
• Granted Patent: US 9,155,206 B2
• Time in Patent Office: Days
• US Class Current: 174/261
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H05B 2203/016 Heaters using particular connecting means
• CPC Class Codes: H05B 3/84 Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/1031 Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10962 Component not directly connected to the PCB
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1). The body (2) itself can also be configured so as to be resilient by way of incisions (6) and/or equipped with a plug-in lug (5).

Claims

1. A solder connection element for soldering onto a substrate for connection of an electrical component, comprising:

a body;

at least two solder feet, wherein the at least two solder feet protrude from the body; and

one or more elastically deformable connecting parts, wherein the one or more elastically deformable connecting parts are adapted to accommodate differences in thermal expansion extending between the body and the at least two solder feet, and wherein the at least two solder feet are adapted to accommodate differences in thermal expansion and effects of mechanical forces from the electrical component in at least two coordinate directions parallel to the substrate.

2. The solder connection element of claim 1, wherein the body comprises portions, wherein the portions are deformable for compensating for stresses acting between the at least two solder feet.

3. The solder connection element of claim 1, wherein the body is formed directly by a line portion to which the at least two solder feet are fastened in a predefined arrangement.

4. The solder connection element of claim 1, wherein the body contains incisions and/or punched-out portions.

5. The solder connection element of claim 4, wherein the incisions and/or punched-out portions in the body form a plug-in lug for attaching a plug connector.

6. The solder connection element of claim 4, wherein the body contains a feature selected from the group consisting of a weld, a solder surface, an adhesive surface, a plug-in lug, a plug-in socket, a push-button, and combinations thereof.

7. The solder connection element of claim 1, wherein the body, the one or more elastically deformable connecting parts and the at least two solder feet are configured in one piece or a plurality of pieces.

8. The solder connection element of claim 1, wherein the solder connection element is connected to at least one fixedly attached flexible conductor portion, wherein the at least one fixedly attached flexible conductor portion contains a plug part at its free end.

9. The solder connection element of claim 1, wherein the body is sheathed in its circumference which does not serve as a connection surface with an insulating material.

10. The solder connection element of claim 1, wherein the at least two solder feet are arranged at mutually identical or different distances.

11. The solder connection element of claim 1, wherein the at least two solder feet contain solder surfaces, wherein the solder surfaces are attached at their body-remote ends or folded down therefrom.

12. A substrate containing the solder connection element of claim 1.

13. The substrate according to claim 12, wherein the substrate contains glass, ceramics, polymers or layers or mixtures thereof.

14. The substrate according to claim 13, wherein the polymer contains polycarbonate, polymethyl methacrylate or blends thereof.

15. The substrate according to claim 14, wherein the substrate is single glazing or double glazing.