Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same

• US 20100320179A1
• Filed: 08/20/2008
• Published: 12/23/2010
• Est. Priority Date: 10/16/2007
• Status: Abandoned Application

• Current Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
• Original Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
• Inventors: Morita, Hideki, Shimizu, Seiji, Fukuhara, Kenji
• Application Number:
  US12/526,330
• Publication Number:
  US 20100320179A1
• Time in Patent Office: Days
• US Class Current: 219/121.69
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: B28D 5/0011 with preliminary treatment, e.g. weakening by scoring
• CPC Class Codes: C03B 33/033 Apparatus for opening score lines in glass sheets
• CPC Class Codes: C03B 33/04 Cutting or splitting in curves, especially for making spectacle lenses
• CPC Class Codes: C03B 33/091 using at least one focussed radiation beam, e.g. laser beam C03B33/0955 takes precedence
• CPC Class Codes: Y02P 40/57 Improving the yield, e-g- reduction of reject rates

Abstract

A method for creating a trench in U shape according to which trenches in lines which are continuous or broken or curved in a plane can be easily created on the surface of a substrate, as well as a chamfering method using this, are provided.

A trench in U shape is created by peeling part of a brittle material substrate from the surface of the substrate by rapidly heating the substrate with conditions for irradiation with a laser for creating a trench in U shape which include the laser power as found in advance, the area to be irradiated with a laser, and the scanning speed, in accordance with the substrate material, which is the object to be processed, and the width, depth and form of the trench in U shape to be created. A chamfered surface is made of a trench surface which is part of a trench in U shape created between an end surface and a surface of the substrate, which are separated along a line along which the substrate is to be divided, between a start end and a finish end of said line along which the substrate is to be divided at the bottom of the created trench in U shape in accordance with a method for scribing a substrate by expanding a crack with a laser, a scribing method using a cutter wheel or the like.

Claims

1. A method for creating a trench in U shape in a brittle material substrate, characterized in that a trench in U shape is created when a portion of a brittle material substrate is peeled from the surface by rapidly heating the portion on the surface of said substrate under heating conditions that make peeling possible.

2. The method for creating a trench in U shape in a brittle material substrate according to claim 1, characterized in that the rapid heating means is a laser, and a trench in U shape is created by scanning a surface of a brittle material substrate with a laser beam with conditions for irradiation with a laser for creating a trench in U shape which include the laser power as found in advance, the area to be irradiated with a laser and the scanning speed corresponding to the substrate material of the object to be processed, and the width, depth and form of the trench in U shape to be created, where the substrate is scanned with a laser beam under said conditions for irradiation with a laser, so that the material in the heated portion peels from the substrate material in the vicinity of the border between the heated portion and the unheated portion, due to thermal expansion, and thus, a trench having an interface in U shape is created by removing the heated portion.

3. The method for creating a trench in U shape in a brittle material substrate according to claim 2, wherein the laser power conditions are as in the following Formula (I) in accordance with the substrate material of the object to be processed, the area to be irradiated with a laser, and the scanning speed:

P=K·

(S×

V) 

 

(1)

where P is the laser power (W) for irradiation, S is the area irradiated with a laser (mm²), V is the scanning speed (mm/sec) and K is the coefficient of the object to be processed (W×

sec/mm³).

4. A method for creating a trench in U shape on a flat surface of an object to be processed by removing part of the substrate or repeatedly creating parallel trenches in U shape on a flat surface of an object to be processed using the method for creating a trench in U shape in a brittle material substrate according to claim 1.

5. A method for removing at least part of an object to be processed from a surface on the outer periphery while rotating the object to be processed around a rotational axis using the method for creating a trench in U shape in a brittle material substrate according to claim 1.

6. A method for hollowing a material by separating the material in a trench in U shape after creating a trench in U shape for a rectangular or curved closed circuit on a plate which is an object to be processed using the method for creating a trench in U shape in a brittle material substrate according to claim 1.

7. A method for chamfering a brittle material substrate, characterized in that a trench in U shape is created on a surface of a substrate using the method for creating a trench in U shape in a brittle material substrate according to claim 1, a chamfered surface is made of a trench surface which is part of a trench in U shape created between an end surface and a surface of the substrate, which are separated along a line along which the substrate is to be divided, between a start end and a finish end of said line along which the substrate is to be divided at the bottom of said created trench in U shape in accordance with a method for scribing a substrate by expanding a crack with a laser, a scribing method using a cutter wheel, or a method for breaking the substrate along a trench without scribing.

8. A method for chamfering a brittle material substrate, characterized in that trenches in U shape are created on the two surfaces;

front and rear, of a substrate so as to face each other with said substrate in between using the method for creating a trench in U shape in a brittle material substrate according to claim 1, a chamfered surface is made of an end surface which is separated along a line along which the substrate is to be divided, and a trench surface which is part of a trench in U shape created between said end surface and a surface of the substrate between a start end and a finish end of said line along which the substrate is to be divided at the bottom of one of the created trenches in U shape in accordance with a scribing method using a laser, a scribing method using a cutter wheel, or a method for breaking the substrate along a trench without scribing.

9. A method for chamfering a brittle material substrate, characterized in that a surface of a brittle material substrate is scribed along a line along which the substrate is to be divided, a trench in U shape which is shallower than the crack created in said scribing step is created along said line along which the substrate is to be divided using the method for creating a trench in U shape in a brittle material substrate according to claim 1, and the substrate is broken along the line along which the substrate is to be divided a chamfered surface is made of a trench surface which is part of a trench in U shape created between an end surface and a surface of the substrate, which are separated.

10. A method for creating a trench in U shape on a surface of a substrate, wherein two approximately parallel scribe lines are created on a surface of a brittle material substrate so as to sandwich lines along which the substrate is to be divided, and then the method for creating a trench in U shape in a brittle material substrate according to claim 1 is used between said lines along which the substrate is to be divided.

11. The method for creating a trench in U shape according to claim 1, characterized in that the trench in U shape is continuous or broken lines or curved lines in a plane.