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Heat Sink and Thermal Plate Apparatus for Electronic Components

  • US 20100320187A1
  • Filed: 06/17/2009
  • Published: 12/23/2010
  • Est. Priority Date: 06/17/2009
  • Status: Abandoned Application
First Claim
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1. An apparatus for dissipating heat from and providing heat to electronic components, comprising:

  • a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module; and

    a heating member embedded in the thermally conductive member.

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