Heat Sink and Thermal Plate Apparatus for Electronic Components
First Claim
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1. An apparatus for dissipating heat from and providing heat to electronic components, comprising:
- a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module; and
a heating member embedded in the thermally conductive member.
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Abstract
An apparatus for dissipating heat from and providing heat to electronic components includes a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module, and a heating member embedded in the thermally conductive member.
35 Citations
14 Claims
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1. An apparatus for dissipating heat from and providing heat to electronic components, comprising:
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a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module; and a heating member embedded in the thermally conductive member. - View Dependent Claims (2, 3, 6)
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- 4. The apparatus of claim 4, wherein the power is applied to the heating member when the thermal switch detects an operating temperature that is below a predetermined level.
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7. A severe environment enclosure for electronic components, comprising:
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a chassis; first and second covers fixedly attachable to the chassis for sealing the enclosure; a processing assembly internal to the enclosure having a thermally conductive member and an adjacent processing module, the thermally conductive member having a surface configured to thermally couple with electronic components mounted on the adjacent processing module; and a heating member embedded in the thermally conductive member. - View Dependent Claims (8, 9, 10, 11, 13, 14)
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12. The severe environment enclosure of claim 12, wherein the power is applied to the heating member when the thermal switch detects an operating temperature that is below a predetermined level.
Specification