STRUCTURE FOR RADIO FREQUENCY IDENTIFICATION AND ITS MANUFACTURING METHOD
1 Assignment
0 Petitions
Accused Products
Abstract
A improved structure RFID includes: a substrate with an entire side of a metal conductive material; a slot antenna disposed on the metal side of the substrate; and an identification chip disposed on the substrate and electrically connected to the slot antenna. The RFID is manufactured using a simpler and cheaper method, so manufacturing costs are significantly reduced while providing low energy consumption, pollution-free, recyclability, and the RFID has high antenna gain, strong reflectivity, and high conductivity. Shield effects provided by the whole metal side of the substrate can also reduce effects to the electrical properties of the RFID caused by the target object and the environment, so the RFID is more suitable for metal objects and conductors with moisture.
20 Citations
18 Claims
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1-7. -7. (canceled)
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8. A manufacturing method for an RFID comprising:
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(A) selecting a substrate with an entire side having an aluminum foil or tin foil conductive metal; (B) spreading the substrate till a thickness thereof being less than 1 μ
m;(C) rolling up the substrate as a substrate roll; (D) punching a plurality of holes on the substrate corresponding to pins of an identification chip respectively with the holes spacing apart from each other with a predetermined distance; (E) attaching the identification chip to the respective holes on the substrate roll with a conductive adhesive; (F) forming a slot antenna on the substrate roll corresponding to the identification chip; (G) treating the slot antenna with resin coating and filming processes to form a RFID. - View Dependent Claims (10, 11, 12, 14)
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9. (canceled)
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13. (canceled)
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15. A manufacturing method for an RFID comprising:
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(A) selecting a substrate with an entire side having an aluminum foil or tin foil conductive metal; (B) spreading the substrate till a thickness thereof being less than 1 μ
m;(C) rolling up the substrate as a substrate roll; (D) punching a plurality of holes on the substrate corresponding to pins of an identification chip respectively with the holes spacing apart from each other with a predetermined distance; (E) forming a slot antenna on the substrate roll corresponding to the holes respectively; (F) attaching the identification chip to the respective holes on the substrate roll with a conductive adhesive; (G) treating the slot antenna with resin coating and filming processes to form a RFID. - View Dependent Claims (16, 17, 18)
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Specification