LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

• US 20100320479A1
• Filed: 11/26/2008
• Published: 12/23/2010
• Est. Priority Date: 11/29/2007
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Minato, Shunsuke, Sano, Masahiko
• Granted Patent: US 9,024,340 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05023 the whole internal layer protruding from the surface
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05669 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05671 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05673 Rhodium [Rh] as principal constituent
• CPC Class Codes: H01L 2224/0568 Molybdenum [Mo] as principal constituent
• CPC Class Codes: H01L 2224/05684 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2933/0091 : Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 : characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting apparatus and a production method of the apparatus are provided that can emit light with less color unevenness at high luminance. The apparatus includes a light emitting device, a transparent member receiving incident light emitted from the device, and a covering member. The transparent member is formed of an inorganic material light conversion member including an externally exposed emission surface, and a side surface contiguous to the emission surface. The covering member contains a reflective material, and covers at least the side surfaces of the transparent member. Substantially only the emission surface serves as the emission area of the apparatus. It is possible to provide emitted light having excellent directivity and luminance. Emitted light can be easily optically controlled. In the case where each light emitting apparatus is used as a unit light source, the apparatus has high secondary usability.

Claims

1. A light emitting apparatus comprising:

a light emitting device,

a light transparent member that receives incident light emitted from the light emitting device, and

a covering member, wherein

said light transparent member is formed of an inorganic material light conversion member that has an externally exposed light emission surface and a side surface contiguous to the light emission surface, wherein

said covering member contains a light reflective material, and covers at least the side surface of said light transparent member.

2. The light emitting apparatus according to claim 1, wherein said covering member surrounds said light emitting device.

3. The light emitting apparatus according to claim 2, wherein said light transparent member is plate-shaped, and has a light receiving surface opposed to said light emission surface, wherein said light emitting device is joined to said light receiving surface.

4. The light emitting apparatus according to claim 3, wherein said light emitting device is mounted on a mount substrate in a flip-chip mounting manner.

5. The light emitting apparatus according to claim 3, wherein said covering member covers said light emitting device.

6. The light emitting apparatus according to claim 3, wherein said light emitting device is enclosed by said light transparent member in plan view from said light emission surface side.

7. The light emitting apparatus according to claim 2, wherein a plurality of light emitting devices as the light emitting devices are optically connected to one light transparent member as the light transparent member.

8. A light emitting apparatus comprising:

a plurality of light emitting devices,

a covering member that surrounds the light emitting device, and

a light transparent member, wherein

said light transparent member is a plate-shaped light conversion member that is made of an inorganic material, and has an externally exposed light emission surface, a side surface contiguous to the light emission surface and a light receiving surface opposed to said light emission surface, wherein

the plurality of light emitting devices are joined to the light receiving surface of said light transparent member, and light from each of the light emitting devices is incident upon the light receiving surface, wherein

said covering member contains a light reflective material, and covers at least the side surface of said light transparent member.

9. The light emitting apparatus according to claim 8, wherein each of said light emitting devices is mounted on a mount substrate in a flip-chip mounting manner.

10. The light emitting apparatus according to claim 8, wherein said covering member covers each of said light emitting devices.

11. The light emitting apparatus according to claim 8, wherein each of said light emitting devices is separated away from said covering member by a hollow part.

12. The light emitting apparatus according to claim 8, wherein said covering member includes, on said light emission surface side of the light emitting apparatus, an externally exposed surface substantially coplanar with said light emission surface.

13. The light emitting apparatus according to claim 8, wherein said light emitting devices are enclosed by said light transparent member in plan view from said light emission surface side.

14. The light emitting apparatus according to claim 13, wherein junction areas and a covering area are arranged on the light receiving surface side of said light transparent member, wherein said light emitting devices are joined to the junction areas, and the covering area is covered by said covering member.

15. The light emitting apparatus according to claim 14, wherein said light emitting devices are separated away from each other, and a separation area is arranged on the light receiving surface side of said light transparent member between said junction areas, wherein said covering area is arranged in said separation area.

16. The light emitting apparatus according to claim 14, wherein said light transparent member includes a protrusion area that protrudes outward relative to said light emitting devices, wherein said covering area is arranged in the protrusion area of said light receiving surface.

17. The light emitting apparatus according to claim 8, wherein said covering member contains, in a transparent resin, at least one oxide containing an element selected from the group consisting of Ti, Zr, Nb and Al as said light reflective material.

20. The light emitting apparatus according to claim 8, wherein said light conversion member contains a phosphor, and can convert the wavelength of at least a part of light emitted from said light emitting device, wherein said light conversion member is a sintered material of an inorganic substance and said phosphor.

21. The light emitting apparatus according to claim 20, wherein said inorganic substance is alumina (Al₂O₃), and said phosphor is YAG (Y₃Al₅O₁₂).

18. (canceled)

19. (canceled)

22. A method for producing a light emitting apparatus including a light emitting device, a light transparent member that receives incident light emitted from the light emitting device, and a covering member, the method comprising:

a first step for mounting said light emitting device on a wiring substrate so that the light emitting device and the wiring substrate are electrically connected to each other;

a second step for optically connecting at least a part of a light outgoing side opposed to the mount side of said light emitting device to said light transparent member; and

a third step for covering a side surface of said light transparent member extending in the thickness direction by said covering member, the covering member being formed so that the external surface of the covering member extends along the external surface of said light transparent member.