THERMAL HEAD UNIT AND THERMAL PRINTER WITH DRIVER IC ON FLEXIBLE SUBSTRATE
First Claim
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1. A thermal head unit, comprising:
- a head substrate having a heating element serving as a thermal head formed thereon;
a flexible substrate;
a driver IC disposed on the flexible substrate to drive the thermal head; and
a heat sink attached to the head substrate and to the flexible substrate,wherein the driver IC and the flexible substrate are electrically connected to each other, and the driver IC and the head substrate are electrically connected to each other.
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Abstract
A thermal head unit includes a head substrate having a heating element serving as a thermal head formed thereon, a flexible substrate, a driver IC disposed on the flexible substrate to drive the thermal head, and a heat sink attached to the head substrate and to the flexible substrate, wherein the driver IC and the flexible substrate are electrically connected to each other, and the driver IC and the head substrate are electrically connected to each other.
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Citations
10 Claims
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1. A thermal head unit, comprising:
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a head substrate having a heating element serving as a thermal head formed thereon; a flexible substrate; a driver IC disposed on the flexible substrate to drive the thermal head; and a heat sink attached to the head substrate and to the flexible substrate, wherein the driver IC and the flexible substrate are electrically connected to each other, and the driver IC and the head substrate are electrically connected to each other. - View Dependent Claims (2, 3, 4, 5)
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6. A thermal printer, comprising:
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a thermal head unit; a platen roller; and a sheet feed motor, wherein the thermal head unit includes; a head substrate having a heating element serving as a thermal head formed thereon; a flexible substrate; a driver IC disposed on the flexible substrate to drive the thermal head; and a heat sink attached to the head substrate and to the flexible substrate, wherein the driver IC and the flexible substrate are electrically connected to each other, and the driver IC and the head substrate are electrically connected to each other. - View Dependent Claims (7, 8, 9, 10)
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Specification