Electrostatic Discharge Structures and Methods of Manufacture
First Claim
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1. A structure comprising an electrostatic discharge (ESD) network and electrically connected in series to a through wafer via.
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Abstract
Electrostatic discharge (ESD) structures having a connection to a through wafer via structure and methods of manufacture are provided. The structure includes an electrostatic discharge (ESD) network electrically connected in series to a through wafer via. More specifically, the ESD circuit includes a bond pad and an ESD network located under the bond pad. The ESD circuit further includes a through wafer via structure electrically connected in series directly to the ESD network, and which is also electrically connected to VSS.
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Citations
20 Claims
- 1. A structure comprising an electrostatic discharge (ESD) network and electrically connected in series to a through wafer via.
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11. An ESD circuit comprising:
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a bond pad; an ESD network located under the bond pad; and a through wafer via structure electrically connected in series directly to the ESD network, and which is also electrically connected to VSS. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A method of manufacturing an ESD network, comprising:
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forming a bond pad above an interlevel dielectric layer; forming an ESD element having an inductive coil under the bond pad, in the interlevel dielectric layer; and forming a through via structure by lithographic, etching and deposition processes, and which is electrically connected to the inductive coil. - View Dependent Claims (20)
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Specification