MEMS MICROPHONE

• US 20100322443A1
• Filed: 01/27/2010
• Published: 12/23/2010
• Est. Priority Date: 06/19/2009
• Status: Active Grant

• Current Assignee: AAC Acoustic Technologies Company Limited, American Audio Components, Inc.
• Original Assignee: AAC Acoustic Technologies Company Limited, American Audio Components, Inc.
• Inventors: CHEN, Xing-Fu, WU, Zhi-Jiang, SU, Yong-Ze
• Granted Patent: US 8,670,579 B2
• Time in Patent Office: Days
• US Class Current: 381/122
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/06 Arranging circuit leads; Relieving strain on circuit leads
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

Claims

1. A MEMS microphone, comprising:

a cover;

a housing engaging with the cover for forming a cavity, the housing comprising a base and a sidewall extending perpendicularly from the base;

at least one transducer accommodated in the cavity, the transducer having a back volume; and

a conductive case covering the cover and the sidewall of the housing;

wherein the conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

2. The MEMS microphone as described in claim 1, wherein the cover defines an acoustic hole for receiving acoustic signals.

3. The MEMS microphone as described in claim 2, wherein the transducer is mounted on the cover and overlaps at least a portion of the acoustic hole.

4. The MEMS microphone as described in claim 2, wherein the back volume of the transducer communicates with the acoustic hole.

5. The MEMS microphone as described in claim 2, wherein the conductive case defines an acoustic aperture communicating with the acoustic hole.

6. The MEMS microphone as described in claim 1, wherein the cover is a printed circuit board, and the housing defines circuits embedded therein for electrically connecting with the cover.

7. The MEMS microphone as described in claim 1, wherein the cover defines a recess, and the sidewall of the housing defines a protrusion for engaging with the recess.

8. The MEMS microphone as described in claim 1, wherein the sidewall of the housing defines a recess, and the cover defines a protrusion for engaging with the recess.

9. The MEMS microphone as described in claim 6, wherein the cover defines a first group of terminals for electrically connecting with the circuits in the sidewall of the housing and a second group of terminals for electrically connecting with the transducer.