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MOLDED CHIP FABRICATION METHOD AND APPARATUS

  • US 20100323465A1
  • Filed: 08/24/2010
  • Published: 12/23/2010
  • Est. Priority Date: 09/18/2003
  • Status: Active Grant
First Claim
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1. An apparatus for coating a plurality of semiconductor devices, comprising:

  • a mold housing comprising a formation cavity arranged to hold semiconductor devices, said formation cavity further arranged so that a coating material can be introduced into said formation cavity, said coating material at least partially covering said semiconductor devices.

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