MOLDED CHIP FABRICATION METHOD AND APPARATUS
First Claim
1. An apparatus for coating a plurality of semiconductor devices, comprising:
- a mold housing comprising a formation cavity arranged to hold semiconductor devices, said formation cavity further arranged so that a coating material can be introduced into said formation cavity, said coating material at least partially covering said semiconductor devices.
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Accused Products
Abstract
A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.
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Citations
33 Claims
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1. An apparatus for coating a plurality of semiconductor devices, comprising:
a mold housing comprising a formation cavity arranged to hold semiconductor devices, said formation cavity further arranged so that a coating material can be introduced into said formation cavity, said coating material at least partially covering said semiconductor devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus for coating light emitting diodes (LEDs), comprising:
a mold housing comprising a formation cavity arranged to hold a plurality of LEDs, said formation cavity comprising at least a top and bottom surface, said LEDs arranged on said bottom or top surface, said mold housing arranged so that a matrix material can be introduced into said formation cavity at least partially covering said LEDs. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method for coating a plurality of light emitting diodes (LEDs), comprising:
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providing a mold with a formation cavity for holding a plurality of semiconductor devices, said formation cavity at least partially defined by opposing upper and lower sections; mounting a plurality of LEDs within said mold formation cavity sandwiched between said upper and lower sections, with a film between said LEDs and said upper and lower sections, each of said LEDs having contacts and being mounted separately within said formation cavity with one of said contacts covered by said film; injecting or otherwise introducing a curable matrix material into said mold to fill said formation cavity, said curable matrix in contact with said upper and lower sections, and at least partially covering said LEDs, and leaving said film covered contact uncovered by said matrix; curing said matrix material so that said LEDs are at least partially embedded in said matrix material; and
removing said cured matrix material and said embedded LEDs from said formation cavity by detaching said upper and lower sections from said matrix material and said embedded LEDs, leaving said matrix substantially uncovered and said contact uncovered by said matrix material accessible for electrical connection; andseparating said embedded LEDs so that each is at least partially covered by a layer of said cured matrix material. - View Dependent Claims (27, 28, 29)
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30. A method for coating a plurality of semiconductor chips, comprising:
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providing a mold with a formation cavity for holding a plurality of semiconductor chips, said formation cavity at least partially defined by opposing upper and lower sections; mounting a plurality of semiconductor chips within said mold formation cavity directly to at least one of said upper and lower sections, each of said semiconductor chips being mounted separately within said formation cavity; injecting or otherwise introducing curable coating material into said mold to fill said mold formation cavity and at least partially covering said semiconductor chips and said upper and lower sections; curing or otherwise treating said coating material so that said semiconductor chips are at least partially embedded in said cured coating material forming a sheet of semiconductor chips and coating material; removing said sheet from said formation cavity such that said sheet is separated from both said upper and lower sections, leaving said coating material uncovered; and separating said sheet into said individual semiconductor chips. - View Dependent Claims (31, 32, 33)
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Specification