MEDICAL DEVICE ENCAPSULATED WITHIN BONDED DIES
First Claim
1. An implantable medical system comprising:
- a first die substrate with a first outer surface;
a second die substrate with a second outer surface; and
a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate, the first and second die substrates being fixed to each other and substantially hermetically sealed to each other, the medical device substantially encapsulated between the first and second die substrates, the first portion being electrically connected to the second portion, the first and second outer surfaces of the first and second die substrates being directly exposed to a biological material.
1 Assignment
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Accused Products
Abstract
An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.
24 Citations
23 Claims
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1. An implantable medical system comprising:
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a first die substrate with a first outer surface; a second die substrate with a second outer surface; and a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate, the first and second die substrates being fixed to each other and substantially hermetically sealed to each other, the medical device substantially encapsulated between the first and second die substrates, the first portion being electrically connected to the second portion, the first and second outer surfaces of the first and second die substrates being directly exposed to a biological material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of using a medical system comprising:
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forming a first portion of a medical device on a first die substrate, the first die substrate having a first outer surface; forming a second portion of the medical device on a second die substrate, the second die substrate having a second outer surface; fixing the first die substrate to the second die substrate to substantially hermetically seal the first die substrate to the second die substrate, to electrically connect the first and second portions of the medical device together, and to encapsulate the medical device therebetween; and implanting the medical system within a patient to directly expose the first and second outer surfaces to a biological material, the first and second die substrates acting as a barrier between the biological material and the medical device. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. An implantable medical system comprising:
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a cardiac device; a lead; and a medical device assembly that includes; a first die substrate with a first outer surface and a first mating surface, the first outer surface having an outer recess, and the first mating surface having an inner recess; a second die substrate with a second outer surface and a second mating surface; and a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate, the first portion including an outer electrode that is disposed within the outer recess and that is electrically connected to the lead, the first and second mating surfaces being directly bonded to each other non-adhesively to substantially hermetically seal the inner recess and to define a cavity therebetween, the first and second portions being electrically connected to each other, the first and second die substrates encapsulating the medical device therebetween, the first portion including a first pressure electrode that is disposed on an inner surface of the cavity on the first die substrate, the second portion including a second pressure electrode that is disposed on an inner surface of the cavity on the second die substrate, at least one of the first and second die substrates including a diaphragm, the first and second pressure sensor electrodes cooperating to detect an amount of deflection of the diaphragm to detect a blood pressure and sending a corresponding signal to the cardiac device via the lead, the first and second outer surfaces of the first and second die substrates being directly exposed to blood and acting as a barrier between the blood and the medical device.
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Specification