Bonded Assembly Having Low Residual Stress

• US 20100326740A1
• Filed: 06/26/2009
• Published: 12/30/2010
• Est. Priority Date: 06/26/2009
• Status: Abandoned Application

• Current Assignee: Schlumberger Technology Corporation (SLB)
• Original Assignee: Schlumberger Technology Corporation (SLB)
• Inventors: Hall, H. Tracy JR., Hall, David R.
• Application Number:
  US12/492,804
• Publication Number:
  US 20100326740A1
• Time in Patent Office: Days
• US Class Current: 175/428
• CPC Class Codes: B23K 20/023 Thermo-compression bonding
• CPC Class Codes: E21B 10/5735 Interface between the substrate and the cutting element

Abstract

In one aspect of the present invention, a method for forming a bonded assembly comprises providing a first and second portion of the assembly; preparing a mating surface on each portion that conforms substantially to the mating surface of the other portion; rapidly heating a bonding material while substantially heating no more than a thin surface zone adjacent each mating surface, and rapidly assembling the two portions in such a manner as to confine a fraction of the bonding material between the mating surfaces. The first portion may comprise polycrystalline diamond or thermally stable polycrystalline diamond; the second portion may comprise cobalt-cemented tungsten carbide. The assembly may comprise a tool for high-impact applications.

Claims

1. A method for forming a bonded assembly comprising:

providing a first and second portion of the assembly;

preparing a mating surface on each portion that conforms substantially to the mating surface of the other portion;

rapidly heating a bonding material while substantially heating no more than a thin surface zone adjacent each mating surface; and

rapidly assembling the two portions in such a manner as to confine a fraction of the bonding material between the mating surfaces.

2. The method of claim 1, wherein the bonded assembly comprises a high impact tool.

3. The method of claim 1, wherein the first portion comprises a hard material suitable for impacting, fracturing, crushing, abrading, cutting, indenting, scraping, shearing, compressing, resisting abrasion, resisting erosion, resisting corrosion, or providing a bearing surface, and wherein the second portion comprises a supporting structure for said first portion.

4. The method of claim 3 wherein the hard material comprises diamond or cubic boron nitride.

5. The method of claim 4, wherein the hard material comprises polycrystalline diamond and at least a portion of the polycrystalline diamond is thermally stable.

6. The method of claim 5, wherein at least a portion of any non-diamond material within the polycrystalline diamond is removed or altered, as by acid leaching, electrolytic dissolution;

ion implanting, diffusing with another material, or alloying.

7. The method of claim 1, wherein the second portion comprises cobalt-cemented tungsten carbide, any other carbide, a metal, a cermet, or a ceramic.

8. The method of claim 1, wherein the bonding material comprises any combination of:

a thin surface zone within at least one portion that is adjacent to its mating surface;

a thin coating substantially covering at least one of the mating surfaces; and

a separate small body.

9. The method of claim 1, wherein the bonding material comprises tantalum, molybdenum, tungsten, cobalt, nickel, iron, titanium, zirconium, hafnium, vanadium, niobium, chromium, manganese, rhenium, ruthenium, rhodium, iridium, palladium, platinum, copper, silver, gold, zinc, cadmium, boron, aluminum, gallium, indium, silicon, germanium, tin, lead, antimony, bismuth, beryllium, magnesium, a lanthanoid, a carbide, a metal hydride, a metalloid, carbon or graphite, an intercalated graphite compound, a metal-coated polymer, an electrically conducting polymer, a metal-coated ceramic, an electrically conducting ceramic, a cermet, or a semiconductor.

10. The method of claim 9, wherein said bonding material is provided as a thin coating covering at least a portion of either of the mating surfaces.

11. The method of claim 9 wherein the bonding material comprises a thin foil or wire provided as a separate small body.

12. The method of claim 11, wherein the thin foil or wire is heated by an electric current provided by a source comprising a battery, a transformer, a low-internal resistance AC or DC power supply, a capacitor, a homopolar generator, or a Marx generator.

13. The method of claim 1, wherein the mating surfaces form a solid solution or eutectic with each other or where either material of either mating surface, in its liquid form, forms a contact angle with the other mating surface that is less than 90 degrees.

14. The method of claim 1, wherein the mating surface of the first portion comprises diamond and the diamond is first coated with any combination of the group comprising titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, rhenium, ruthenium, rhodium, iridium, palladium, platinum, boron, silicon, and a lanthanoid;

and the first coating is subsequently coated with any combination of the group comprising cobalt, nickel, iron, copper, silver, gold, zinc, cadmium, beryllium, magnesium, aluminum, gallium, indium, germanium, tin, lead, antimony, or bismuth.

15. The method of claim 1, wherein the heat capacity of the fraction of the bonding material that is trapped between the two portions, at the bonding temperature, is less than one-half of the heat capacity of either portion at room temperature.

16. The method of claim 1, wherein the bonding material is heated to at least its melting point.

17. The method of claim 1, wherein the bonding material is heated to at least its boiling point.

18. The method of claim 1, wherein the bonding material is heated by transient pulse of energy provided by any combination of friction, laser beam, electron beam, radio frequency induction heating, electric discharge between and predominantly normal to the mating surfaces, electrical discharge between and predominantly parallel to the mating surfaces, or by chemical explosive.

19. The method of claim 1, wherein the bonding is conducted in vacuum, a reducing atmosphere, or an inert atmosphere.

20. The method of claim 1, wherein the first and second portions and the bonding material are contained within a close-fitting refractory sleeve during the steps of heating and assembling.

21. A high impact tool formed by a process comprising the steps of;

providing a first and second portion of the tool;

preparing a mating surface on one portion that conforms substantially to the mating surface of the other portion;

rapidly heating a bonding material while substantially heating no more than a thin surface zone adjacent each mating surface; and

rapidly assembling the two portions in such a manner as to confine a fraction of the bonding material between the mating surfaces.

22. The tool of claim 21, wherein the first portion comprises polycrystalline diamond, at least a portion of which may be thermally stable, and the second portion comprises a support material comprising cemented-cobalt tungsten carbide, a carbide, a metal, a cermet, or a ceramic.

23. The tool of claim 21, wherein the polycrystalline diamond comprises a working surface that is substantially pointed, substantially dome shaped, substantially cylindrical, or substantially flat.

24. A method of bonding a high impact tool to a tool holder, comprising the steps of:

preparing a mating surface on the high-impact tool that conforms substantially to a mating surface on the tool holder;

rapidly heating a bonding material while substantially heating no more than a thin surface zone adjacent each mating surface; and

rapidly assembling the high impact tool and the tool holder in such a manner as to confine a fraction of the bonding material between the mating surfaces.

25. The method of claim 24 wherein the high impact tool comprises polycrystalline diamond and the tool holder comprises steel, such as a steel-body rock bit, a steel asphalt disintigrator drum, a steel-body concrete pavement disintigrator, or other high-impact steel-body tool or steel-body machine.