LED LIGHTING DEVICE

• US 20100327301A1
• Filed: 09/04/2009
• Published: 12/30/2010
• Est. Priority Date: 06/29/2009
• Status: Active Grant

• Current Assignee: Lextar Electronics Corporation (Ennostar, Inc.)
• Original Assignee: Lighthouse Technologies (Ennostar, Inc.)
• Inventors: WU, MENG-CHAI, YANG, HE-SHUN
• Granted Patent: US 8,092,046 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

An LED lighting device includes a circuit board, a plurality of LED units, a waterproof layer and a middle layer. The LED units are disposed on the circuit board by surface mounted way. The light beam emitted from the LED units emits from the light-emitting surface. The waterproof layer wraps the circuit board and the LED units. The middle layer is located between the light-emitting surface and the water-proof layer. The middle layer extends from a direction of the LED units being disposed on the circuit board so that the middle layer fully covers the light-emitting surface. The light beams passing through the light-emitting surface enters into the waterproof layer via the middle layer. Thereby, the middle layer is located between the LED units and the waterproof layer to make the color of the light beam be more uniform.

Claims

1. An LED lighting device, comprising:

a circuit board;

at least one LED unit connected with the circuit board, wherein each LED unit has a light-emitting surface;

a middle layer fully covering the light-emitting surface; and

a waterproof layer, wherein the waterproof layer wraps the circuit board, the LED units and the middle layer, the middle layer is located between the light-emitting surface and the water-proof layer, and each of the light beams emitted from the LED units passes through the light-emitting surface, the middle layer and the waterproof layer.

2. The LED lighting device as claimed in claim 1, wherein the middle layer extends along a direction of the LED unit being disposed on the circuit board, and the middle layer covers the light-emitting surface of the LED unit.

3. The LED lighting device as claimed in claim 1, wherein the middle layer includes at least one cover layer, the quantity of the cover layer corresponds to the quantity of the LED units, and each of the cover layers covers the light-emitting layer of each of the LED units.

4. The LED lighting device as claimed in claim 3, wherein the cover layer is a rectangular thin layer.

5. The LED lighting device as claimed in claim 1, wherein each of the LED units has a package layer, the light-emitting surface is located at the top of the package, the package layer contains phosphor powder, and the light beam passing through the package layer is excited to form light beam with different colors.

6. The LED lighting device as claimed in claim 1, wherein the middle layer contains air, inertia gas, or tiny solid particles that its dimension is smaller than 0.1 mm.

7. The LED lighting device as claimed in claim 6, wherein the material of the tiny solid particles is metal, metal oxide, oxide silicon, talcum, silica gel, or plastic.

8. The LED lighting device as claimed in claim 1, wherein the middle layer includes a liquid that is transparent and not conducted.

9. The LED lighting device as claimed in claim 8, wherein the liquid that is transparent and not conducted is alcohol, or silica gel oil.