JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME

• US 20100327443A1
• Filed: 02/19/2009
• Published: 12/30/2010
• Est. Priority Date: 02/22/2008
• Status: Abandoned Application

• Current Assignee: Barun Electronics Co., Ltd.
• Original Assignee: Barun Electronics Co., Ltd.
• Inventors: Kim, Sung-Wook
• Application Number:
  US12/918,326
• Publication Number:
  US 20100327443A1
• Time in Patent Office: Days
• US Class Current: 257/741
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H05K 2201/0373 Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307

Abstract

The present invention concerns a joining structure and a substrate-joining method using the same. The joining structure comprises a substrate, and comprises a plurality of joining patterns which are located on the said substrate and which are spaced apart from each other. The substrate-joining method using the joining structure can comprise: a stage involving the formation of a plurality of joining patterns which are spaced apart from each other on a first substrate; and a stage of joining a second substrate on the plurality of joining patterns. When the said joining structure is employed, it is possible to reduce or prevent damage due to spreading of the joining substance during joining of the two substrates.

Claims

1. A bonding structure comprising:

a first substrate;

a second substrate; and

multiple bonding patterns provided on the first substrate and spaced apart from each other,

wherein the bonding patterns include a first bonding pattern of a closed curve shape which directly contacts with the first and the second substrates.

2. The bonding structure of claim 1, wherein the bonding patterns have a shape of a straight line, a bent line, or a curve.

4. The bonding structure of claim 2, wherein the height of the bonding patterns from the substrate is less than 10 times the thickness of each of the bonding patterns.

5. The bonding structure of claim 2, wherein a distance between adjacent bonding patterns among the multiple bonding patterns is less than the sum of thicknesses of the adjacent bonding patterns.

6. The bonding structure of claim 1, wherein the multiple bonding patterns further include:

one or more second bonding patterns enclosing the first bonding pattern and having openings formed thereon.

7. The bonding structure of claim 1, wherein the bonding patterns are formed of a eutectic solder, a high-melting-point solder, a lead-free solder, gold, or a gold alloy.

8. The bonding structure of claim 1, wherein the bonding patterns include two or more materials selected from the group consisting of a eutectic solder, a high-melting-point solder, a lead-free solder, gold, a gold alloy, copper, a copper alloy, titanium, a titanium alloy, chrome, a chrome alloy, nickel, a nickel alloy, aluminum, an aluminum alloy, vanadium, and a vanadium alloy.

3. (canceled)

9. A substrate bonding method comprising:

forming multiple bonding patterns spaced apart from each other on a first substrate; and

bonding a second substrate on the multiple bonding patterns,

wherein the bonding patterns include a first bonding pattern of a closed curve shape which directly contacts with the first and the second substrates.

10. The substrate bonding method of claim 9, where said bonding a second substrate on the multiple bonding patterns includes melting the multiple bonding patterns.

11. The substrate bonding method of claim 9, wherein the bonding patterns have a shape, such as a straight line, a bent line, or a curve.

13. The substrate bonding method of claim 11, wherein the height of the bonding patterns from the first substrate is less than 10 times the thickness of each of the bonding patterns.

14. The substrate bonding method of claim 11, wherein the distance between adjacent bonding patterns among the multiple bonding patterns is less than the sum of the thicknesses of the adjacent bonding patterns.

15. The substrate bonding method of claim 9, wherein the multiple bonding patterns further include:

one or more second bonding patterns enclosing the first bonding pattern and having openings formed thereon.

16. The substrate bonding method of claim 9, wherein the bonding patterns includes a eutectic solder, a high-melting-point solder, a lead-free solder, gold, or a gold alloy.

17. The substrate bonding method of claim 9, wherein the bonding patterns include two or more materials selected from the group consisting of a eutectic solder, a high-melting-point solder, a lead-free solder, gold, a gold alloy, copper, a copper alloy, titanium, a titanium alloy, chrome, a chrome alloy, nickel, a nickel alloy, aluminum, an aluminum alloy, vanadium, and a vanadium alloy.

12. (canceled)