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METHODS FOR WAFER-LEVEL PACKAGING OF MICROFEATURE DEVICES AND MICROFEATURE DEVICES FORMED USING SUCH METHODS

  • US 20100327462A1
  • Filed: 09/02/2010
  • Published: 12/30/2010
  • Est. Priority Date: 08/30/2005
  • Status: Active Grant
First Claim
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1. A microfeature assembly, comprising:

  • a generally rigid, temporary carrier substrate;

    a plurality of first known good microelectronic dies releasably attached to the carrier substrate in a desired arrangement, wherein the carrier substrate is patterned with the desired arrangement before the first known good dies are releasably attached;

    a plurality of second known good microelectronic dies attached to corresponding first dies in a stacked configuration; and

    an encapsulant at least partially encapsulating the first dies and second dies.

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