Power Module and Vehicle-Mounted Inverter Using the Same

• US 20100327654A1
• Filed: 06/29/2010
• Published: 12/30/2010
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Hayakawa, Seiichi, Sasaki, Koji, Mori, Mutsuhiro, AZUMA, Katsunori, Hiyoshi, Michiaki, Yoshida, Isamu
• Granted Patent: US 8,519,561 B2
• Time in Patent Office: Days
• US Class Current: 307/9.1
• CPC Class Codes: B60L 2200/26 Rail vehicles
• CPC Class Codes: B60L 50/11 using DC generators and DC motors
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H03K 17/08148 : in composite switches
• CPC Class Codes: H03K 2017/0806 : against excessive temperature
• CPC Class Codes: H05K 7/1432 : specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 : wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: Y02T 10/70 : Energy storage systems for electromobility, e.g. batteries
• CPC Class Codes: Y02T 10/7072 : Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors

Abstract

A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

Claims

1. A power module comprising

an upper arm circuit unit and a lower arm circuit unit, each including a power semiconductor element;

an insulating substrate with the upper arm circuit unit and the lower arm circuit unit mounted on one surface thereof;

a metal base bonded onto the other surface of the insulating substrate which is opposite to the one surface where the upper and lower arm circuit units are mounted;

a first connection conductor for supplying a high potential to the upper arm circuit unit from outside;

a second connection conductor for supplying a low potential to the lower arm circuit unit from outside;

an insulating sheet interposed between the first connection conductor and the second connection conductor; and

a resin case disposed on the metal base to support the first and second connection conductors,

wherein the first and second connection conductors are flat conductors and laminated with the insulating sheet sandwiched between them;

wherein the insulating sheet extends from one end of the laminated structure so as to secure the creepage distance between the first and second connection conductors; and

wherein the resin case is furnished with a recess for containing the laminated structure of the first and second connection conductors and the insulating sheet.

2. The power module according to claim 1, wherein the ends of each of the first and second connection conductors are provided with external connection lugs for connection with the power module, and the insulating sheet extends close to the external connection lugs.

3. The power module according to claim 2, wherein the resin case is provided with screw sections for screwing down the external connection lugs, the screw section being capable of transferring the stress imposed on the external connection lugs to the resin case.

4. The power module according to claim 3, wherein the exposed portion of the insulating sheet that protrudes from the lamination is covered with insulating gel so that the creepage distance of the insulating sheet can be diminished.

5. The power module according to claim 3, wherein the first and second connection conductors and the insulating sheet have bends the tip portions of which are placed in the recess so that the positions of the first and second connection conductors and the insulating sheet can be fixed.

6. A vehicle-mounted inverter incorporating therein the power module and the capacitor module according to claim 1, comprising

a laminated bus bar consisting of two conductor plates and an insulating sheet sandwiched therebetween and connecting the power module and the capacitor module electrically,

wherein the peripheral ends of the two conductor plates are provided with connecting portions, respectively;

wherein one of the first and second connection conductors of the power module is disposed close to and connected with, one of the two conductor plates of the laminated bus bar; and

wherein the laminated bus bar is disposed over one of the first and second connection conductors of the power module when they are electrically connected with each other, so that the insulating sheet of the laminated bus bar overlaps those portions of the insulating sheer which lie between the connection lugs of the first and second connection conductors, in the direction perpendicular to the surface of the laminated bus bar.