COOLING DEVICE FOR SEMICONDUCTOR ELEMENT MODULE AND MAGNETIC PART

• US 20100328893A1
• Filed: 06/22/2010
• Published: 12/30/2010
• Est. Priority Date: 06/29/2009
• Status: Active Grant

• Current Assignee: Honda Motor Co., Ltd. (Honda Motor Company)
• Original Assignee: Honda Motor Co., Ltd. (Honda Motor Company)
• Inventors: YOSHINO, Tsutomu, HIGASHIDANI, Yoshihiko, KATO, Takeshi, NAGANO, Masao
• Granted Patent: US 8,064,198 B2
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins.

Claims

1. A cooling device for a semiconductor element module and a magnetic part, comprising:

a water-cooled type heat sink having a cooling water passage;

a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink;

a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink; and

a plurality of cooling fins disposed to extend in the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side along the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction.

2. The cooling device for a semiconductor element module and a magnetic part according to claim 1, wherein

each the semiconductor element module includes a pair of semiconductor elements which are disposed at separate locations along the circulation direction of the cooling water passage.

3. The cooling device for a semiconductor element module and a magnetic part according to claim 1, wherein

a plurality of the semiconductor element modules are mounted separately on opposite surfaces of the heat sink having the cooling water passage.

4. The cooling device for a semiconductor element module and a magnetic part according to claim 1, wherein

the semiconductor element module is mounted on the heat sink having the cooling water passage, with a plurality of semiconductor elements buried in a covering layer made of a synthetic resin.

5. The cooling device for a semiconductor element module and a magnetic part according to claim 1, wherein

the plurality of cooling fins are integrally molded.

6. The cooling device for a semiconductor element module and a magnetic part according to claim 1, wherein

a flat mounting surface is formed on the heat sink on which a plurality of the magnetic parts are mounted,

the magnetic parts are housed in a common housing case in such a manner that axes of the winding portions of the magnetic parts are perpendicular to the mounting surface, and

the housing case is mounted on the mounting surface.

7. The cooling device for a semiconductor element module and a magnetic part according to claim 6, wherein

the plurality of magnetic parts are an inductor and a transformer.

8. The cooling device for a semiconductor element module and a magnetic part according to claim 6, wherein

the housing case includes:

a supporting plate portion with which the magnetic parts are brought into contact; and

a cover portion which covers the magnetic parts and is connected to the supporting plate portion, and

the supporting plate portion having a greater plate thickness than that of the cover portion is mounted on the mounting surface while being in contact with the mounting surface.

9. The cooling device for a semiconductor element module and a magnetic part according to claim 1, wherein

a flat mounting surface is formed on the heat sink having mounted thereon the magnetic part having a resin covering portion in which at least part of the winding portion is buried, the flat mounting surface formed to be perpendicular to an axis of the winding portion and to be in contact with the resin covering portion and the core, and

at least part of a heat dissipation plate made of metal is buried in the resin covering portion.

10. The cooling device for a semiconductor element module and a magnetic part according to claim 9, wherein

the heat dissipation plate is buried in the resin covering portion while being in direct contact with the mounting surface.

11. The cooling device for a semiconductor element module and a magnetic part according to claim 9, wherein

a mounting plate portion mounted on the mounting surface while being in contact with the mounting surface is provided integrally to the heat dissipation plate in such a manner as to project from the resin covering portion.

12. The cooling device for a semiconductor element module and a magnetic part according to claim 9, wherein

the heat dissipation plate is formed to sandwich the winding portion at least in the axis direction of the winding portion from both sides thereof.