LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR VEHICLE DEVICE USING SAME

• US 20100328901A1
• Filed: 06/24/2010
• Published: 12/30/2010
• Est. Priority Date: 06/24/2009
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Kabune, Hideki, Furumoto, Atsushi, MINATO, Hideki
• Granted Patent: US 8,630,095 B2
• Time in Patent Office: Days
• US Class Current: 361/730
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/4103 Connectors having different sizes
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/84 using a strap connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/41 of a plurality of strap connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H02K 11/0094 : Structural association with other electrical or electronic devices
• CPC Class Codes: H02K 11/026 : Suppressors associated with brushes, brush holders or their supports
• CPC Class Codes: H02K 11/028 : Suppressors associated with the rotor
• CPC Class Codes: H02K 11/05 : Rectifiers associated with casings, enclosures or brackets
• CPC Class Codes: H02K 11/33 : Drive circuits, e.g. power electronics H02K11/38 takes precedence
• CPC Class Codes: H02K 2211/03 : Machines characterised by circuit boards, e.g. pcb
• CPC Class Codes: H02K 3/522 : for generally annular cores with salient poles
• CPC Class Codes: H02K 9/227 : Heat sinks

Abstract

A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

Claims

1. A linked semiconductor module unit comprising:

a plurality of semiconductor modules each including at least one semiconductor chip, a land on which the semiconductor chip is mounted, and a resin part that encapsulates the semiconductor chip and embed the land; and

a linking member embedded in the resin part to link the plurality of semiconductor modules;

wherein the linking member is configured such that a plurality of embedded portions of the plurality of semiconductor modules, which are embedded in the resin part, and an exposed portion, which is placed between the embedded portions and exposed from the resin part, are formed integrally and continuously.

2. The linked semiconductor module unit according to claim 1, wherein:

the linking member includes a bent portion that is bent at the exposed portion.

3. The linked semiconductor module unit according to claim 2, wherein:

the bent portion includes a curved portion that is a circular bulge formed on a linear portion.

4. The linked semiconductor module unit according to claim 1, wherein:

the linking member is connected to supply an electrical current to the semiconductor chip.

5. The linked semiconductor module unit according to claim 4, wherein:

the linking member includes a first conductive member and a second conductive member, the first conductive member being connected to a power source, the second conductive member being connected to a ground.

6. The linked semiconductor module unit according to claim 1, wherein:

the linking member is formed integrally with the land.

7. The linked semiconductor module unit according to claim 1, wherein:

the linking member is positioned in parallel with a surface of the semiconductor chip.

8. The linked semiconductor module unit according to claim 1, wherein:

the linking member is positioned perpendicularly to a surface of the semiconductor chip.

9. The linked semiconductor module unit according to claim 1, wherein:

the linking member protrudes from two opposing surfaces of each of the semiconductor modules.

10. The linked semiconductor module unit according to claim 1, wherein:

the linking member protrudes from two neighboring surfaces of each of the semiconductor modules.

11. The linked semiconductor module unit according to claim 1, wherein:

the plurality of semiconductor modules are mounted on a same plane.

12. The linked semiconductor module unit according to claim 1, wherein:

the plurality of semiconductor modules are mounted on different planes.

13. The linked semiconductor module unit according to claim 1, wherein:

the land includes a heat dissipation portion that protrudes in a direction opposite to that of a mounting surface, on which the semiconductor chip is mounted, and is exposed from the resin part.

14. The linked semiconductor module unit according to claim 1, wherein:

each of the plurality of semiconductor modules includes switching elements that change a coil current flowing to a multiple-phase coil of a motor.

15. The linked semiconductor module unit according to claim 14, wherein:

each of the plurality of semiconductor modules includes a power relay that shuts off supply of power from a power source to the switching element.

16. The linked semiconductor module unit according to claim 14, wherein:

each of the plurality of semiconductor modules includes a motor relay that shuts off supply of power from the switching element to the motor.

17. The linked semiconductor module unit according to claim 1, wherein:

each of the plurality of semiconductor modules includes a fuse that blows when an overcurrent flows to the motor.

18. The linked semiconductor module unit according to claim 1, wherein:

each of the plurality of semiconductor modules includes a capacitor therein.

24. The electronic circuit-integrated motor device according to claim 18, wherein:

the linking member includes a first conductive member and a second conductive member, the first conductive member being connected to a power source, the second conductive member being electrically connected with a connection member to the heat sink connected to a ground.

19. An electronic circuit-integrated motor device comprising:

a tubular motor case;

a stator positioned on a radially inside part of the motor case and wound with a multiple-phase coil;

a rotor positioned in a radially inside part of the stator;

a shaft fit in the rotor to be rotatable the rotor;

a plurality of semiconductor modules, each having a switching element for changing a coil current flowing to the multiple-phase coil; and

a linking member linking the plurality of semiconductor modules to form a linked semiconductor module unit,

wherein each of the semiconductor modules includes at least one semiconductor chip that forms the switching element, a land on which the semiconductor chip is mounted, and a resin part that encapsulates the semiconductor chip and embeds the land therein, and

wherein the linking member is configured so that a plurality of embedded portions of the plurality of semiconductor modules, which are embedded in the resin part, and an exposed portion, which is placed between the embedded portions and exposed from the resin part, are formed integrally and continuously.

20. The electronic circuit-integrated motor device according to claim 19, wherein:

the linking member includes a bent portion that is bent at the exposed portion.

21. The electronic circuit-integrated motor device according to claim 20, wherein:

the bent portion includes a curved portion that is a circular bulge formed on a linear portion.

22. The electronic circuit-integrated motor device according to claim 20, further comprising:

a heat sink mounted on an axial end wall of the motor case in a raised manner,

wherein the linked semiconductor module unit is bent at the bent portion on a radially outside part of the heat sink along the heat sink, and positioned around a rotation axis of the motor.

23. The electronic circuit-integrated motor device according to claim 20, further comprising:

a heat sink mounted on an axial end wall of the motor case in a raised manner,

wherein the linked semiconductor module unit is bent at a radially inside part of the heat sink along the heat sink, and positioned around a rotation axis of the motor.

25. The electronic circuit-integrated motor device according to claim 19, wherein:

the plurality of semiconductor modules are disposed within an axial projection range of the motor case.

26. The electronic circuit-integrated motor device according to claim 19, wherein:

the plurality of semiconductor modules are perpendicularly disposed in such a manner that a line perpendicular to a surface of the semiconductor chip is not parallel to a central axis of the shaft.

27. The electronic circuit-integrated motor device according to claim 26, wherein:

the linking member has a thickness in a radial direction of the shaft, the thickness being less than a width thereof in an axial direction of the shaft.