Coil Transducer Isolator Packages

• US 20100328902A1
• Filed: 06/30/2009
• Published: 12/30/2010
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Tay, Gary, Fouquet, Julie E., Ho, Dominique, Baumgartner, Richard A.
• Granted Patent: US 7,948,067 B2
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.

Claims

1. A coil transducer isolator package comprising:

at least one lead frame;

at least a first and a second IC (integrated circuit);

a flex circuit, the flex circuit comprising at least a first coil transducer;

wherein the at least first coil transducer comprises at least one metal coil;

wherein no portion of the at least one lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil;

wherein boundaries of the spatial volume are defined by a periphery of the at least one metal coil;

wherein the at least first IC is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.

2. The coil transducer isolator package as in claim 1 wherein the flex circuit further comprises polyimide.

3. The coil transducer isolator package as in claim 1 wherein the at least first coil transducer is a transformer.

4. The coil transducer isolator package as in claim 1 wherein the at least first IC is a transmitter.

5. The coil transducer isolator package as in claim 1 wherein the at least second IC is a receiver.

6. The coil transducer isolator package as in claim 1 wherein a distance of approximately two mils or more is maintained between the at least one metal coil and the at least first IC.

7. The coil transducer isolator package as in claim 6 wherein one or more electrical insulating materials are positioned between the at least first IC and the at least one metal coil.

8. The coil transducer isolator package as in claim 7 wherein the electrical insulator material is selected from a group consisting of kapton, polyimide and a combination of epoxy resin and glass fiber.

9. The coil transducer isolator package as in claim 1 wherein the at least second IC is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.

10. The coil transducer isolator package as in claim 1 wherein a distance of approximately two mils or more is maintained between the at least one metal coil and the at least second IC.

11. The coil transducer isolator package as in claim 10 wherein one or more electrical insulating materials are positioned between the at least second IC and the at least one metal coil.

12. The coil transducer isolator package as in claim 11 wherein the electrical insulator material is selected from a group consisting of kapton, polyimide and a combination of epoxy resin and glass fiber.

13. The coil transducer isolator package as in claim 1 wherein at least a portion of the at least one lead frame is physically located over the at least first IC.

14. The coil transducer isolator package as in claim 9 wherein at least a portion of the at least one lead frame is physically located over the at least second IC.

15. The coil transducer isolator package as in claim 9 wherein at least a portion of the at least one lead frame is physically located over the at least first IC and over the at least second IC.

16. A coil transducer isolator package comprising:

at least one lead frame;

at least a first and a second IC (integrated circuit);

a flex circuit, the flex circuit comprising at least a first coil transducer;

wherein the at least first coil transducer comprises at least one metal coil;

wherein no portion of the at least one lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil;

wherein boundaries of the spatial volume are defined by a periphery of the at least one metal coil;

wherein no portion of the at least first and second ICs are physically located within the spatial volume extending substantially perpendicular to the at least one metal coil;

wherein at least a portion of the at least one lead frame is physically located over the at least first IC.

17. The coil transducer isolator package as in claim 16 wherein at least a portion of the at least one lead frame is physically located over the at least second IC.

18. A coil transducer isolator package comprising:

a lead frame;

at least a first and a second IC (integrated circuit), the at least first IC having a first input and a differential output, the at least second IC having a differential input and an output;

a flex circuit, the flex circuit comprising at least a first coil transducer, ground pads and internal supply voltage routing;

wherein the at least first coil transducer comprises at least one metal coil;

wherein the at least first coil transducer has a differential input and a differential output;

wherein the differential input of the at least first coil transducer is electrically connected to the differential output of the at least first IC;

wherein the differential output of the at least first coil transducer is electrically connected to the differential input of the at least second IC;

wherein no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil;

wherein boundaries of the spatial volume are defined by a periphery of the at least one metal coil.

19. The coil transducer isolator package as in claim 18 wherein the lead frame comprises at least six leads;

wherein a voltage VDD₁ is applied to a first lead;

wherein a first electrical signal is applied to a second lead;

wherein a voltage GND₁ is applied to a third lead;

wherein a voltage VDD₂ is applied to a fourth lead;

wherein a second electrical signal is received from a fifth lead;

wherein a voltage GND₂ is applied to a sixth lead.

20. The coil transducer isolator package as in claim 19 wherein the first lead is wire bonded to a first internal supply voltage routing and the at least first IC;

wherein the second lead is wire bonded to the input of the at least first IC;

wherein the third lead is wire bonded to a first ground pad;

wherein the fourth lead is wire bonded to a second internal voltage routing and the at least second IC;

wherein the fifth lead is wire bonded to the output of the at least second IC;

wherein the sixth lead is wire bonded to a second ground pad.