METHODS FOR GENERATING A STANDARD REFERENCE DIE FOR USE IN A DIE TO STANDARD REFERENCE DIE INSPECTION AND METHODS FOR INSPECTING A WAFER
1 Assignment
0 Petitions
Accused Products
Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
106 Citations
45 Claims
-
1-31. -31. (canceled)
-
32. A computer-implemented method for detecting defects on a wafer, comprising:
-
combining multiple images of a structure formed on the wafer to generate a composite image of the structure, wherein the multiple images are acquired at multiple positions on the wafer at which the structure is formed; and comparing the composite image to a reference to detect defects on the wafer. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
-
Specification