METHOD OF ENCAPSULATING AN ENVIRONMENTALLY SENSITIVE DEVICE

• US 20100330748A1
• Filed: 01/26/2007
• Published: 12/30/2010
• Est. Priority Date: 10/25/1999
• Status: Abandoned Application

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Chu, Xi, Lin, Steve Shi, Graff, Gordon L.
• Application Number:
  US11/627,602
• Publication Number:
  US 20100330748A1
• Time in Patent Office: Days
• US Class Current: 438/127
• CPC Class Codes: B32B 2037/246 Vapour deposition
• CPC Class Codes: B32B 2307/546 Flexural strength; Flexion stiffness
• CPC Class Codes: B32B 2307/7244 Oxygen barrier
• CPC Class Codes: B32B 2307/7246 Water vapor barrier
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/0076 characterised in that the layers are not bonded on the totality of their surfaces
• CPC Class Codes: B32B 37/02 characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
• CPC Class Codes: B32B 37/1207 Heat-activated adhesive B32B37/04 takes precedence
• CPC Class Codes: B32B 37/30 Partial laminating
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H10K 10/88 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 30/88 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 71/851 : Division of substrate
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y10T 428/239 : Complete cover or casing

Abstract

Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

Claims

1. A method of encapsulating an environmentally sensitive device comprising:

providing a flexible substrate in discrete sheet form;

temporarily laminating the flexible substrate adjacent to a rigid support;

optionally applying a first barrier stack adjacent to the flexible substrate, the first barrier stack comprising at least one barrier layer and at least one decoupling layer;

applying the environmentally sensitive device adjacent to the flexible substrate;

applying a second barrier stack adjacent to the environmentally sensitive device, the second barrier stack comprising at least one barrier layer and at least one decoupling layer, the environmentally sensitive device being encapsulated between the substrate and the second barrier stack, the substrate and the second barrier stack forming a seal, or between the first barrier stack and the second barrier stack, the first and second barrier stacks forming a seal; and

removing the encapsulated environmentally sensitive device from the rigid support.

2. The method of claim 1 wherein the flexible substrate is temporarily laminated to the rigid support with a reversible adhesive selected from heat activated adhesive, pressure sensitive adhesive, UV activated adhesive, or combinations thereof.

3. The method of claim 1 wherein the flexible substrate is cut into the discrete sheet form before the flexible substrate is laminated adjacent to the rigid support.

4. The method of claim 1 wherein the flexible substrate is cut into the discrete sheet form after the flexible substrate is laminated adjacent to the rigid support.

5. The method of claim 1 wherein the flexible substrate is cut into the discrete sheet form and wherein the first barrier stack is applied before the flexible substrate is cut into the discrete sheet form.

6. The method of claim 1 wherein the flexible substrate is cut into the discrete sheet form and wherein the first barrier stack is applied after the flexible substrate is cut into the discrete sheet form.

7. The method of claim 1 wherein the first barrier stack is applied before the flexible substrate is laminated adjacent to the rigid support.

8. The method of claim 1 wherein the first barrier stack is applied after the flexible substrate is laminated adjacent to the rigid support.

9. The method of claim 1 further comprising separating the encapsulated environmentally sensitive device on the flexible substrate from another encapsulated environmentally sensitive device on the flexible substrate.

10. The method of claim 1 wherein the first barrier stack is applied using a mask.

11. The method of claim 1 wherein the second barrier stack is applied using a mask.

12. The method of claim 1 wherein the first barrier stack is sealed at an edge.

13. The method of claim 1 wherein the second barrier stack is sealed at an edge.

14. The method of claim 1 further comprising applying a functional layer adjacent to the flexible substrate.

15. The method of claim 1 wherein the first barrier stack is applied on a side of the flexible substrate opposite the environmentally sensitive device.

16. The method of claim 1 wherein applying a second barrier stack adjacent to the environmentally sensitive device comprises depositing the second barrier stack adjacent to the environmentally sensitive device.

17. The method of claim 16 wherein depositing the second barrier stack adjacent to the environmentally sensitive device comprises vacuum depositing the second barrier stack adjacent to the environmentally sensitive device.

18. The method of claim 1 wherein applying a second barrier stack adjacent to the environmentally sensitive device comprises laminating the second barrier stack adjacent to the environmentally sensitive device.

19. The method of claim 16 wherein the second barrier stack is laminated adjacent to the environmentally sensitive device using heat, adhesive, or combinations thereof.

20. The method of claim 1 further comprising applying an array of thin film transistors before the environmentally sensitive device is applied.

21. The product produced by the method of claim 1.

22. A method of encapsulating an environmentally sensitive device comprising:

providing a flexible substrate in discrete sheet form;

temporarily laminating the flexible substrate adjacent to a rigid support;

applying a first barrier stack adjacent to the flexible substrate, the first barrier stack comprising at least one barrier layer and at least one decoupling layer;

applying the environmentally sensitive device adjacent to the flexible substrate;

applying a sheet of barrier material adjacent to the environmentally sensitive device to encapsulate the environmentally sensitive device between the first barrier stack and the sheet of barrier material, the first barrier stack and the sheet of barrier material forming a seal; and

removing the encapsulated environmentally sensitive device from the rigid support.