SENSING MODULE FOR ORTHOPEDIC LOAD SENSING INSERT DEVICE

• US 20100331683A1
• Filed: 06/29/2010
• Published: 12/30/2010
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Roche, Martin, Stein, Marc
• Granted Patent: US 9,492,119 B2
• Time in Patent Office: Days
• US Class Current: 600/437
• CPC Class Codes: A61B 5/4509 Bone density determination
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/6846 specially adapted to be brought in contact with an internal body part, i.e. invasive
• CPC Class Codes: A61B 5/6878 Bone
• CPC Class Codes: A61B 5/7239 using differentiation including higher order derivatives
• CPC Class Codes: A61B 8/15 Transmission-tomography

Abstract

A sensing insert device (100) is disclosed for measuring a parameter of the muscular-skeletal system. The sensing insert device (100) can be temporary or permanent. The sensing module (200) is a self-contained encapsulated measurement device having at least one contacting surface that couples to the muscular-skeletal system. The sensing module (200) comprises one or more sensing assemblages (2302), electronic circuitry (307), an antenna (2302), and communication circuitry (320). The sensing assemblages (2302) are between a top plate (1502) and a bottom plate (1504) in a sensing platform (121). The bottom plate (1504) is supported by a ledge (1708) on an interior surface of a sidewall (1716) of a housing (1706). A cap (1702) couples to top plate (1502). The sensing assemblage (2302) includes one of a piezo-resistive sensor, MEMS sensor, strain gauge, or mechanical sensor when a force, pressure, or load is applied to the top plate (1502).

Claims

1. A sensing module for measuring a parameter of the muscular-skeletal system comprising:

a sensing platform to measure a force, pressure, or load where the parameter is measured by a piezo-resistive sensor; and

a housing including at least one support structure interior to the housing where the sensing platform is supported by the at least one support structure.

2. The sensing module of claim 1 where the at least one support structure is a ledge formed on an interior sidewall of the housing and where the sensing platform is supported by the ledge a predetermined distance above a bottom surface of the housing.

3. The sensing module of claim 2 further including electronic circuitry operatively coupled to the sensing platform where the electronic circuitry resides between the sensing platform and the bottom surface of the housing.

4. The sensing module of claim 3 further including a first printed circuit board supported by a support structure of the housing a predetermined distance from the bottom surface of the housing.

9. The sensing module of claim 1 further including a trial insert allowing articulation of the muscular-skeletal system when inserted where the trial insert comprises a dock and the sensing module and where the trial insert is substantially equal in dimensions to a final insert.

10. The sensing module of claim 1 where the sensing module is in a final insert.

5. The sensing module of 4 further including a cap overlying the sensing platform.

6. The sensing module of claim 5 where an adhesive seals the cap to the housing thereby forming an encapsulated enclosure and where the cap is moveable under a force, pressure, or load applied thereto.

7. The sensing module of claim 5 further including a second printed circuit board where electronic components mounted on the first printed circuit board are directed towards the bottom surface and where components of the second printed circuit board are directed towards an opening in the housing.

8. The sensing module of claim 7 where the sensing platform comprises at least three sensing assemblages and where parameter measurements from the at least three sensing assemblages determine a location where the parameter is applied on a surface of the sensing platform.

11. A sensing module for measuring a force, pressure, or load applied by the muscular-skeletal system comprising an encapsulating enclosure having therein a sensing platform overlying electronic circuitry operatively coupled to at least one piezo-resistive sensor of the sensing platform.

12. The sensing module of claim 11 where the sensing platform comprises:

a first support structure;

a second support structure; and

at least one sensing assemblage including a piezo-resistive sensor coupled between the first and second support structures.

13. The sensing module of claim 12 where the encapsulating structure includes a housing and where the housing includes at least one support structure interior to the housing that supports the second support structure of the sensing platform.

14. The sensing module of claim 13 further including a cap coupled to the first support structure where the cap and the first structure is moveable in relation to the housing when a force, pressure, or load is applied thereto.

15. The sensing module of claim 14 further including an adhesive coupling the cap to the housing where the adhesive is flexible allowing movement of the cap in relation to the housing.

16. An prosthetic component for measuring a parameter of the muscular-skeletal system comprising:

an insert having substantial equal dimensions to a final insert for permanent implantation in the muscular-skeletal system having a first major surface and a second major surface where the insert when inserted allows articulation of the muscular-skeletal system; and

a sensing platform having a first surface and a second surface for receiving a force, pressure, or load applied thereacross where the first surface and second surface respectively couple to the first and second major surfaces of the insert, and where the sensing platform includes one of a piezo-resistive sensor, MEMS sensor, strain gauge, or mechanical sensor.

17. The prosthetic component of claim 16 further including an encapsulating enclosure enclosing the sensing platform.

18. The prosthetic component of claim 17 where the encapsulating enclosure comprises

a housing;

and

a cap where the housing includes at least one support structure interior to the housing that supports the second surface of the sensing platform, where the cap couples to the first surface of the sensing platform, and where the cap moves in relation to the housing when the force, pressure, or load is applied thereto.

19. The prosthetic component of claim 18 where electronic circuitry operatively coupled to the sensing platform is between the second surface of the sensing platform and a bottom of the housing.

20. The prosthetic component of claim 19 where the sensing platform includes three or more sensing assemblages for taking parameter measurements at three or more predetermined locations of the first surface to determine a location on the first surface where the parameter is applied.