ARRANGEMENT FOR IDENTIFYING UNCONTROLLED EVENTS AT THE PROCESS MODULE LEVEL AND METHODS THEREOF

• US 20100332014A1
• Filed: 06/29/2010
• Published: 12/30/2010
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Venugopal, Vijayakumar C., Albarede, Luc
• Granted Patent: US 8,618,807 B2
• Time in Patent Office: Days
• US Class Current: 700/110
• CPC Class Codes: G05B 2219/31202 Semiconductor equipment communication standard SECS
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

A method for detecting an in-situ fast transient event within a processing chamber during substrate processing is provided. The method includes a set of sensors comparing a data set to a set of criteria (in-situ fast transient events) to determine if the first data set includes a potential in-situ fast transient event. If the first data set includes the potential in-situ fast transient event, the method also includes saving an electrical signature that occurs in a time period during which the potential in-situ fast transient event occurs. The method further includes comparing the electrical signature against a set of stored arc signatures. If a match is determined, the method yet also includes classifying the electrical signature as a first in-situ fast transient event and determining a severity level for the first in-situ fast transient event based on a predefined set of threshold ranges.

Claims

1. A method for detecting an in-situ fast transient event within a processing chamber of a plasma processing system during substrate processing, said method comprising:

analyzing a first data set collected by a set of sensors, wherein said analyzing includes comparing said first data set to a set of criteria to determine if said first data set includes a potential in-situ fast transient event, wherein said set of criteria defines a set of in-situ fast transient events;

if said first data set includes said potential in-situ fast transient event, saving an electrical signature that occurs in a time period during which said potential in-situ fast transient event occurs;

comparing said electrical signature against a set of stored arc signatures;

if a match is determined, classifying said electrical signature as a first in-situ fast transient event; and

determining a severity level for said first in-situ fast transient event based on a predefined set of threshold ranges.

2. The method of claim 1 wherein said analyzing of said first data set includes performing a fast sampling transient algorithm.

3. The method of claim 2 wherein said fast sampling transient algorithm is executed by a sensor controller.

4. The method of claim 2 wherein said fast sampling transient algorithm is executed by a computing module, wherein said computing module is configured at least to be coupled to one of a sensor and a sensor controller.

5. The method of claim 2 wherein said fast sampling transient algorithm is executed by an analyzing module that is configured to interact directly with a sensor of said set of sensors.

6. The method of claim 5 wherein said analyzing module is a process-module-level analysis server that is configured to perform analysis for each process module and a set of sensors associated with said each process module.

7. The method of claim 1 further including determining a course of action based on said severity level of said first in-situ fast transient event.

8. The method of claim 1 wherein said first in-situ fast transient event is a micro-arcing event.

9. The method of claim 1 wherein said first data set is being collected by fast-transient sensors that are capable of performing a high sampling rate.

10. The method of claim 1 wherein said electrical signature is added to a library as a non-fast transient event signature if said electrical signature does not match one of said set of stored arc signatures.

20. The arrangement of claim 1 wherein said fast sampling transient algorithm module is controlled by a computing module, wherein said computing module is configured at least to be coupled to one of a sensor and a sensor controller.

11. An arrangement for detecting an in-situ fast transient event within a processing chamber of a plasma processing system, wherein said processing chamber includes a plurality of sensors configures for collecting data during substrate processing, said arrangement comprising:

a fast sampling transient algorithm module configured for comparing said data against a set of criteria and extracting an electrical signature from said data, wherein said set of criteria defines a set of predefined in-situ fast transient events; and

an analyzing module, wherein said analyzing module communicates directly with said fast sampling transient algorithm module, wherein said analyzing module is configured for performing at least

receiving said electrical signature,

comparing said electrical signature against a set of stored arc signatures,

classifying said electrical signature as a fast transient event if a match occurs, and

determining a severity level for said fast transient event based on a predefined set of threshold ranges.

12. The arrangement of claim 11 further including a library, wherein said library is configured for storing said set of stored arc signatures.

13. The arrangement of claim 12 wherein said library is configured for storing non-fast transient signatures.

14. The arrangement of claim 11 wherein analyzing module is configured for sending said course of action directly to a process module controller when said fast transient event is identified during said substrate processing.

15. The arrangement of claim 11 wherein said analyzing module is further configured for determining a course of action based on said severity level of said fast transient event.

16. The arrangement of claim 11 wherein said fast transient event is a micro-arcing event.

17. The arrangement of claim 11 wherein said fast sampling transient algorithm module is controlled by an analyzing module that is configured to interact directly with said plurality of sensors.

18. The arrangement of claim 11 wherein said analyzing module is a process-module-level analysis server that is configured to perform analysis for each process module and a set of sensors associated with said each process module.

19. The arrangement of claim 11 wherein said fast sampling transient algorithm module is controlled by a sensor controller.