Thin flat solid state light source module
First Claim
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1. A flat LED package device, comprising:
- a thermal conductive substrate;
at least one LED chip mounted on said substrate;
at least one electrical circuit pattern layered on said substrate, wherein said LED chip and said circuit are electrically connected; and
a flat reflecting layer, deposited on said substrate, surrounding said LED chip.
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Abstract
Thin, flat solid state light source device and methods for manufacturing is described. LED chips and their circuit boards are mounted on a thermal conductive substrate. The LED chips are surrounded with a flat layer of reflecting material which may embed the circuit boards. The LED chips and the reflecting layer is then topped with a layer of diffusion material and a layer of cover material.
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Citations
40 Claims
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1. A flat LED package device, comprising:
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a thermal conductive substrate; at least one LED chip mounted on said substrate; at least one electrical circuit pattern layered on said substrate, wherein said LED chip and said circuit are electrically connected; and a flat reflecting layer, deposited on said substrate, surrounding said LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A flat LED lamp device, comprising:
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a thermal conductive substrate; plurality of LED chips mounted on said substrate, and arrayed in parallel; one or more electrical circuits layered on said substrate, and placed in between said LED chips, wherein said LED chip and said circuit are electrically connected; and a flat reflecting layer, deposited on said substrate, surrounding said LED chips. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A method for making flat LED lamp device module, comprising the actions of the steps of:
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coating a thermal conductive substrate with a layer of thermal conductive and electrical insulating composite; forming circuit boards on the insulated surface of the substrate; mounting a plurality of LED chips via a layer of thermal conductive adhesive composite to the insulated surface of the substrate; electrically connecting said plurality of LED chips with at least one circuit board; depositing a flat layer of reflecting composite on the substrate surrounding the LED chips, but exposing the surfaces of the LED chips, forming a flat LED lamp package; and depositing a light conducting cover layer over the reflecting layer and the surface of the LED chips, encapsulating the surface of lamp package. - View Dependent Claims (36, 37, 38, 39, 40)
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Specification