ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT

• US 20110001237A1
• Filed: 10/21/2008
• Published: 01/06/2011
• Est. Priority Date: 03/06/2008
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Brun, Jean, Verrun, Sophie, Vicard, Dominique
• Granted Patent: US 8,723,312 B2
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/85365 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns

Abstract

The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.

Claims

1-11. -11. (canceled)

12. Assembly comprising at least one microelectronic chip provided with a groove for housing a wire element having an axis parallel to the longitudinal axis of the groove, said groove being delineated by at least two facing side walls, wherein the assembly is such that:

the two side walls are separated by a larger distance than the diameter of the wire element,

at least one bump is arranged on a first of the two side walls, said bump defining, with the second side wall, a clamping area having a height that is smaller than the diameter of the wire element, said clamping area being located on a part of the first side wall and,

aid wire element is secured to the chip at the level of the clamping area.

13. Assembly according to claim 12, wherein the chip is provided with two parallel main surfaces and with lateral surfaces, at least one of the lateral surfaces comprising the groove.

14. Assembly according to claim 12, wherein the location of the clamping area is delineated by a free area arranged laterally to the bump along the longitudinal axis of the groove, said free area having a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.

15. Assembly according to claim 12, wherein the clamping area has a height comprised between 98 and 80% of the diameter of the wire element.

16. Assembly according to claim 12, wherein the diameter of the wire element is greater than the distance separating the bump from the bottom of the groove, and the wire element is also in contact with the bottom of the groove.

17. Assembly according to claim 12, wherein at least one of the bumps is an electrically conducting bump.

18. Assembly according to claim 12, wherein the two side walls of the groove support bumps arranged in zigzag manner.

19. Assembly according to claim 12, wherein each bump is in the form of a bar having an axis perpendicular to the bottom of the groove.

20. Assembly according to claim 19, wherein each bar has an apex of triangular cross-section.

21. Assembly according to claim 12, wherein the wire element comprises an electrically conducting core covered with an insulator, the sum of the diameter of the core and of the thickness of the insulator being greater than the height of the clamping area.

22. Assembly according to claim 12, comprising an insulating or conducting glue between the wire element and groove.