ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT
1 Assignment
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Accused Products
Abstract
The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
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Citations
22 Claims
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1-11. -11. (canceled)
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12. Assembly comprising at least one microelectronic chip provided with a groove for housing a wire element having an axis parallel to the longitudinal axis of the groove, said groove being delineated by at least two facing side walls, wherein the assembly is such that:
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the two side walls are separated by a larger distance than the diameter of the wire element, at least one bump is arranged on a first of the two side walls, said bump defining, with the second side wall, a clamping area having a height that is smaller than the diameter of the wire element, said clamping area being located on a part of the first side wall and, aid wire element is secured to the chip at the level of the clamping area. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification