Transponder and Booklet

• US 20110002107A1
• Filed: 10/10/2008
• Published: 01/06/2011
• Est. Priority Date: 02/22/2008
• Status: Active Grant

• Current Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Inventors: Tanaka, Junsuke, Mizuguchi, Yoshiyuki, Yamamoto, Akihisa, Maehira, Makoto
• Granted Patent: US 9,934,459 B2
• Time in Patent Office: Days
• US Class Current: 361/762
• CPC Class Codes: G06K 19/025 the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs methods for testing the genuineness of valuable papers, e.g. banknotes or passports G07D7/00; constructional features of booklets and the like B42D
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A transponder includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet; a sealing material having electrical insulation is provided between the IC module and an inside face of the opening.

Claims

1. A transponder which comprises an inlet comprising an antenna sheet, which comprises an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet, the transponder comprising:

a sealing material having electrical insulation being provided between the IC module and an inside face of the opening.

2. The transponder according to claim 1, wherein the sealing material is arranged such as to cover the outer surface of the IC module exposed in the opening, and is formed such that an outer surface of the second base material and an outer surface of the sealing material are continuous and roughly flat.

3. The transponder according to claim 2, wherein a step between the outer surface of the second base material and the outer surface of the sealing material is no larger than 20 μ

m.

4. The transponder according to claim 1, wherein the sealing material is formed such as to cover a connection section between the antenna coil and the IC module, and a jumper line that connects the antenna coil to the IC module.

5. The transponder according to claim 1, wherein the IC module comprises a lead frame, an IC chip mounted on the lead frame, and a sealing resin section which seals the IC chip;

and

the longitudinal elastic modulus of the sealing material is less than the longitudinal elastic modulus of the sealing resin section.

6. The transponder according to claim 1, wherein the sealing material is a resin tape comprising a sticky material and a support.

7. The transponder according to claim 6, wherein the IC module comprises a lead frame, an IC chip mounted on the lead frame, and a sealing resin section which seals the IC chip;

and

the longitudinal elastic modulus of at least one of the sticky material and the support is less than the longitudinal elastic modulus of the sealing resin section.

8. The transponder according to claim 1, wherein the first base material is a cover material.

9. The transponder according to claim 1, wherein a cover is joined to at least one of the outer surface of the first base material and the outer surface of the second base material.

10. The transponder according to claim 1, wherein the antenna sheet and the sealing material are molded in a single piece.

11. The transponder according to claim 1, comprising a chloride ion-resistant layer formed such as to cover at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module.

12. The transponder according to claim 1, comprising a water-resistant layer formed such as to cover at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module.

13. A booklet which comprises a transponder comprising:

an inlet comprising an antenna sheet, which comprises an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet;

a sealing material having electrical insulation being provided between the IC module and an inside face of the opening.