SYSTEMS AND LEADS WITH A RADIALLY SEGMENTED ELECTRODE ARRAY AND METHODS OF MANUFACTURE

• US 20110005069A1
• Filed: 07/07/2009
• Published: 01/13/2011
• Est. Priority Date: 07/07/2009
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Pianca, Anne Margaret
• Granted Patent: US 8,887,387 B2
• Time in Patent Office: Days
• US Class Current: 29/825
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: H01R 13/567 Traverse cable outlet or wire connection
• CPC Class Codes: H01R 4/62 Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors H01R4/68 takes precedence
• CPC Class Codes: H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors of trolley lines B60M1/28
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A method of making a lead for a stimulation device includes forming at least one pre-electrode in the shape of a ring, the at least one pre-electrode comprises at least two thin-walled portions separated by at least two thick-walled portions; disposing the at least one pre-electrode near a distal end of a lead body; joining at least one conductor to each thick-walled portion of the at least one pre-electrode; and grinding the lead body and the at least one pre-electrode to remove the thin-walled portions of the at least one pre-electrode to form segmented electrodes from the thick-walled portions of the at least one pre-electrode.

Claims

1. A method of making a lead for a stimulation device comprising:

forming at least one pre-electrode in the shape of a ring, the at least one pre-electrode comprises at least two thin-walled portions separated by at least two thick-walled portions;

disposing the at least one pre-electrode near a distal end of a lead body;

joining at least one conductor to each thick-walled portion of the at least one pre-electrode; and

grinding the lead body and the at least one pre-electrode to remove the thin-walled portions of the at least one pre-electrode to form a plurality of segmented electrodes from the thick-walled portions of the at least one pre-electrode.

2. The method of claim 1, wherein disposing the at least one pre-electrode near the distal end of the lead body comprises disposing a plurality of the pre-electrodes near the distal end of the lead body and further comprising separating the pre-electrodes using at least one spacer.

3. The method of claim 2, further comprising reflowing the at least one spacer.

4. The method of claim 1, wherein the thin-walled portions of the at least one pre-electrode are equally spaced around the circumference of the at least one pre-electrode.

5. The method of claim 2, wherein the at least one pre-electrodes comprises three thin-walled portions.

6. The method of claim 1, wherein forming the lead body comprises forming a lead body having an ablated section and disposing the at least one pre-electrode on the ablated section of the lead body.

7. The method of claim 4, wherein the lead body includes a proximal end and a distal end, and wherein the ablated section is disposed on the distal end of the lead body.

8. The method of claim 1, wherein the at least one conductor is a plurality of conductors and wherein joining at least one conductor comprises individually welding the conductors at regular intervals around the circumference of the lead body.

9. The method of claim 1, wherein grinding the lead body comprises centerless grinding the lead body.

10. The method of claim 1, wherein the at least one pre-electrode comprises marks for coupling with the lead body.

11. A method of making a lead for a stimulation device comprising:

coupling a plurality of electrodes to a plate;

joining individual conductors to each of the plurality of electrodes;

forming the plate into a cylinder with the conductors extending through a lumen of the cylinder;

filling the lumen of the cylinder with an insulative material to create a lead assembly; and

removing the plate having the plurality of electrodes exposed.

12. The method of claim 11, wherein forming the plate into a cylinder comprises:

placing a mandrel along the midline of the plate; and

drawing the plate through at least one die to form a substantially cylindrical shape.

13. The method of claim 11, wherein coupling a plurality of electrodes to a plate comprises coupling a plurality of the electrodes to an iron plate.

14. The method of claim 11, wherein coupling a plurality of electrodes to a plate comprises resistance welding sets of the electrodes at multiple levels on the plate, wherein each set of the electrodes is aligned with an adjacent set of the electrodes.

15. The method of claim 11, wherein coupling a plurality of electrodes to a plate comprises resistance welding sets of the electrodes at multiple levels on the plate, wherein adjacent sets of the electrodes are staggered.

16. The method of claim 11, wherein removing the plate comprises placing the lead assembly in an acid bath to dissolve the plate.

17. A method of making a lead for a stimulation device comprising:

disposing a plurality of electrodes in a mold and overmolding in a flexible carrier;

removing the flexible carrier and electrodes from the mold;

joining conductors to the plurality of electrodes to form a carrier;

shaping the carrier into a substantially cylindrical shape; and

joining the carrier to a lead body.

18. The method of claim 17, wherein shaping the carrier comprises wrapping the carrier around a mandrel and placing it an overmold.

19. The method of claim 17, wherein joining conductors to the plurality of electrodes comprises welding conductors to the plurality of electrodes.

20. The method of claim 17, wherein the lead body comprises silicone.