SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE
First Claim
1. A pressure sensor comprising:
- a package substrate;
a pressure sense die directly attached to a first side of the package substrate with a stress compliant adhesive;
an application specific integrated circuit electrically connected to the sense die and attached to the first side of the package substrate;
a cover mounted over the first side of the substrate; and
a wire bonding for electrically connecting the pressure sense die to the application specific integrated circuit;
wherein the package substrate has an area-to-thickness ratio less than 100 square units per lineal unit.
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Accused Products
Abstract
A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.
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Citations
21 Claims
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1. A pressure sensor comprising:
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a package substrate; a pressure sense die directly attached to a first side of the package substrate with a stress compliant adhesive; an application specific integrated circuit electrically connected to the sense die and attached to the first side of the package substrate; a cover mounted over the first side of the substrate; and a wire bonding for electrically connecting the pressure sense die to the application specific integrated circuit; wherein the package substrate has an area-to-thickness ratio less than 100 square units per lineal unit.
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2. A pressure detection mechanism comprising:
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a package substrate; a pressure sense die directly attached to a first side of the package substrate with a stress compliant adhesive; an application specific integrated circuit electrically connected to the sense die and attached to the first side of the package substrate; a first cover mounted over the first side of the substrate; and a second cover mounted over a second side of the substrate. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A pressure detection mechanism comprising:
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a package substrate; and a pressure sense die attached to a first side of the package substrate; and wherein the pressure sense die is attached directly to the first side of package substrate with a stress compliant adhesive. - View Dependent Claims (20)
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21. A pressure detection mechanism comprising:
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an alumina-based substrate; and a pressure sense die attached to a package substrate with a stress compliant adhesive; and wherein no isolation substrate or layer is situated between the pressure sense die and the package substrate.
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Specification