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SENSOR PACKAGE ASSEMBLY HAVING AN UNCONSTRAINED SENSE DIE

  • US 20110005326A1
  • Filed: 06/30/2010
  • Published: 01/13/2011
  • Est. Priority Date: 07/10/2009
  • Status: Active Grant
First Claim
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1. A pressure sensor comprising:

  • a package substrate;

    a pressure sense die directly attached to a first side of the package substrate with a stress compliant adhesive;

    an application specific integrated circuit electrically connected to the sense die and attached to the first side of the package substrate;

    a cover mounted over the first side of the substrate; and

    a wire bonding for electrically connecting the pressure sense die to the application specific integrated circuit;

    wherein the package substrate has an area-to-thickness ratio less than 100 square units per lineal unit.

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