FULL PERIMETER CHEMICAL STRENGTHENING OF SUBSTRATES

• US 20110005820A1
• Filed: 09/17/2010
• Published: 01/13/2011
• Est. Priority Date: 06/30/2008
• Status: Active Grant

• Current Assignee: Casey J. Feinstein, John Z. Zhong
• Original Assignee: Casey J. Feinstein, John Z. Zhong
• Inventors: Feinstein, Casey J., Zhong, John Z.
• Granted Patent: US 9,405,388 B2
• Time in Patent Office: Days
• US Class Current: 174/258
• CPC Class Codes: C03C 15/00 Surface treatment of glass, not in the form of fibres or filaments, by etching etching or surface-brightening compositions, in general C09K13/00
• CPC Class Codes: C03C 21/002 to perform ion-exchange between alkali ions C03C21/005 takes precedence
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.

Claims

1. An apparatus comprising:

a glass substrate having a first surface and a second surface, the second surface created by the separation of the substrate from a larger glass sheet; and

one or more conductive traces formed on the first surface of the substrate prior to the separation of the substrate from the larger sheet,

wherein the second surface is strengthened with a chemical treatment by sealing the first surface of the substrate to another substrate with a sealant applied to the first surface, without applying the sealant to a top surface of the conductive traces, applying the chemical treatment, and separating the first surface from the surface of the other substrate after the chemical treatment.

2. The apparatus of claim 1, wherein the chemical treatment comprises an acid polish.

3. The apparatus of claim 1, wherein the chemical treatment comprises cerium oxide.

4. The apparatus of claim 1, wherein the chemical treatment comprises potassium nitrate.

5. The apparatus of claim 1, wherein the conductive traces include a thin film of conductor.

6. The apparatus of claim 5, wherein the thin film conductor includes one of indium tin oxide, amorphous silicon, copper indium diselenide, cadmium telluride, and film crystalline silicon.

7. The apparatus of claim 1, wherein the chemical treatment includes heating the second surface to at least 300°

C.

8. The apparatus of claim 1, wherein a passivation layer including one of silicon dioxide (SiO₂) and silicon nitride (SiNx) is formed over the one or more conductive traces prior to the separation.

9. The apparatus of claim 1, wherein the larger glass sheet includes a third surface that includes the first surface, and the third surface undergoes a strengthening process prior to the formation of the one on more conductive traces, such that after the separation and prior to the chemical treatment, the first surface includes strengthened glass and the second surface includes unstrengthened glass.

10. The apparatus of claim 9, wherein the chemical treatment includes applying a first chemical, and the strengthening process excludes applying the first chemical.

11. The apparatus of claim 1, wherein the glass substrate is separated from larger glass sheet by a separating mechanism including one of etching, laser scribing, mechanical scribing, and grinding and polishing, the second surface including a surface created by the separating mechanism.

12. The apparatus of claim 1, wherein the second surface includes one of a flat surface, a cylindrical surface, an uneven surface, and a surface including extended regions.

13. The apparatus of claim 1, wherein the sealant includes one of polymer film, polyimide, SU-8 photoresist, reworkable pressure sensitive adhesive, and silicone based adhesive.