METHOD OF FORMING A HIGH-K GATE DIELECTRIC LAYER
First Claim
1. A method for manufacturing a semiconductor device, comprising:
- forming a dielectric layer, including;
forming a silicon oxide layer on a semiconductor substrate;
nitriding the silicon oxide layer to form a nitrided silicon oxide layer; and
incorporating lanthanide atoms into the nitrided silicon oxide layer to form a lanthanide silicon oxynitride layer;
wherein incorporating the lanthanide atoms includes forming a lanthanide metal layer on the nitrided silicon oxide layer, and then annealing the lanthanide metal layer and the nitrided silicon oxide layer.
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Abstract
A method for manufacturing a semiconductor device includes forming a gate electrode over a gate dielectric. The gate dielectric is formed by forming a lanthanide metal layer over a nitrided silicon oxide layer, and then performing an anneal to inter-diffuse atoms to form a lanthanide silicon oxynitride layer. A gate electrode layer may be deposited before or after the anneal. In an embodiment, the gate electrode layer includes a non-lanthanide metal layer, a barrier layer formed over the non-lanthanide metal layer, and a polysilicon layer formed over the barrier layer. Hafnium atoms may optionally be implanted into the nitrided silicon oxide layer.
10 Citations
15 Claims
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1. A method for manufacturing a semiconductor device, comprising:
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forming a dielectric layer, including; forming a silicon oxide layer on a semiconductor substrate; nitriding the silicon oxide layer to form a nitrided silicon oxide layer; and incorporating lanthanide atoms into the nitrided silicon oxide layer to form a lanthanide silicon oxynitride layer; wherein incorporating the lanthanide atoms includes forming a lanthanide metal layer on the nitrided silicon oxide layer, and then annealing the lanthanide metal layer and the nitrided silicon oxide layer. - View Dependent Claims (2, 3, 4)
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5. A method for manufacturing a semiconductor device, comprising:
forming a gate electrode over a gate dielectric, including; forming a silicon oxide layer on a semiconductor substrate; nitriding the silicon oxide layer to form a nitrided silicon oxide layer; forming a lanthanide metal layer on the nitrided silicon oxide layer; forming a gate electrode layer over the nitrided silicon oxide layer; and annealing the lanthanide metal layer and the nitrided silicon oxide layer to form a lanthanide silicon oxynitride layer. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A semiconductor device, comprising:
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one or more nMOS transistors on or in a semiconductor substrate, including; a gate dielectric layer on the substrate, the gate dielectric layer consisting essentially of a lanthanide silicon oxynitride layer; a gate electrode on the gate dielectric layer; source and drain structures adjacent to the gate dielectric layer; one or more pMOS transistors on or in the substrate, including; a second gate dielectric layer on the substrate, the second gate dielectric layer being substantially lanthanide-free; a second gate electrode on the lanthanide-free gate dielectric layer; second source and drain structures adjacent to the lanthanide-free gate; insulating layers over the nMOS transistors and pMOS transistors; and interconnects in the insulating layers, wherein the interconnects electrically couple the nMOS and the pMOS transistors. - View Dependent Claims (13, 14, 15)
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Specification