ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

• US 20110006433A1
• Filed: 03/17/2009
• Published: 01/13/2011
• Est. Priority Date: 03/17/2008
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Kanetaka, Yoshifumi
• Granted Patent: US 8,525,333 B2
• Time in Patent Office: Days
• US Class Current: 257/773
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 2201/094 Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads using different types of conductors H05K2201/0391
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic device includes the electronic element, the interposer substrate, on one surface of which the electronic element is mounted, and the interconnection substrate, on one surface of which the interposer substrate is mounted. One portion of the connection parts is an electrical connection part that electrically interconnects the interposer substrate and the interconnection substrate. The remaining portion is a dummy connection part that produces no functional deficiency even when the dummy connection part does not electrically interconnect the interposer substrate with the interconnection substrate. The dummy connection part includes at least one of the connection parts that at least partially overlap with the electronic element in a plan projection and are preferably arranged along an outer rim of the plan projection of the electronic element.

Claims

1. An electronic device comprising:

an electronic element;

an interposer substrate having mounted on one surface thereof said electronic element;

an interconnection substrate having mounted on one surface thereof said interposer substrate; and

a plurality of connection parts interconnecting said interposer substrate and said interconnection substrate;

wherein

one portion of said connection parts comprises an electrical connection that electrically interconnects said interposer substrate with said interconnection substrate, and the remaining portion comprises a dummy connection part that produces no functional deficiency even when said dummy connection part fails to electrically interconnect said interposer substrate with said interconnection substrate; and

said dummy connection part comprises at least one out of said connection parts at least partially overlapping with said electronic element in a plan projection.

2. The electronic device according to claim 1, wherein

among said connection parts that at least partially overlap with said electronic element in the plan projection, said dummy connection part comprises at least one of said connection parts that are arranged along an outer rim of said electronic element in a plan projection.

3. The electronic device according to claim 1, wherein

among said connection parts that at least partially overlap with said electronic element in the plan projection, said dummy connection part comprises at least one of said connection parts that are provided closest to angular parts of said electronic element in a plan projection.

4. The electronic device according to claim 1, wherein

said connection part includes a first electrode formed on the other surface of said interposer substrate, a second electrode formed on said one surface of said interconnection substrate, and a connection material interconnecting said first and second electrodes;

in said electrical connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other; and

in said dummy connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other or a joining material that joins said first and second electrodes to each other.

5. The electronic device according to claim 4, wherein

the Young'"'"'s modulus of said connection material in said dummy connection part is higher than that of said connection material in said electrical connection part.

6. The electronic device according to claim 1, wherein

said dummy connection part is continuously formed along an outer rim of the plan projection of said electronic element in a region at least partially overlapping with said electronic element in the plan projection.

7. The electronic device according to claim 4, wherein

the connection material in said dummy connection part comprises a resin, an electrically conductive resin or an electrically conductive paste.

12. The electronic device according to claim 6, wherein

the connection material in said dummy connection part comprises a resin, an electrically conductive resin or an electrically conductive paste.

13. The electronic device according to claim 2, wherein

among said connection parts that at least partially overlap with said electronic element in the plan projection, said dummy connection part comprises at least one of said connection parts that are provided closest to angular parts of said electronic element in a plan projection.

14. The electronic device according to claim 2, wherein

said connection part includes a first electrode formed on the other surface of said interposer substrate, a second electrode formed on said one surface of said interconnection substrate, and a connection material interconnecting said first and second electrodes;

in said electrical connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other; and

in said dummy connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other or a joining material that joins said first and second electrodes to each other.

15. The electronic device according to claim 3, wherein

said connection part includes a first electrode formed on the other surface of said interposer substrate, a second electrode formed on said one surface of said interconnection substrate, and a connection material interconnecting said first and second electrodes;

in said electrical connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other; and

in said dummy connection part, said connection material comprises an electrically conductive material electrically connecting said first and second electrodes to each other or a joining material that joins said first and second electrodes to each other.

8. A manufacturing method for an electronic device comprising:

mounting an electronic element on an interposer substrate to provide an electronic element package; and

mounting said interposer substrate on an interconnection substrate;

wherein

at least one of a plurality of connection parts interconnecting said interposer substrate and said interconnection substrate is formed as a dummy connection part that produces no function deficiency even if said dummy connection part fails to provide for electrical connection between said interposer substrate and said interconnection substrate; and

said dummy connection part is provided at a position at least partially overlapping with said electronic element in a plan projection.

9. The manufacturing method for an electronic device according to claim 8, wherein

among said connection parts that at least partially overlap with said electronic element in the plan projection, at least one of said connection parts provided along the outer rim of said electronic element is formed as said dummy connection part.

10. The manufacturing method for an electronic device according to claim 8, wherein

among said connection parts that at least partially overlap with said electronic element in the plan projection, at least one of the connection parts that are provided closest to angular parts of said electronic element is formed as said dummy connection part.

11. The manufacturing method for an electronic device according to claim 8, wherein

said dummy connection part is continuously formed along an outer rim of said electronic element in a plan projection in a region that at least partially overlaps with the plan projection of said electronic element.

16. The manufacturing method for an electronic device according to claim 9, wherein

among said connection parts that at least partially overlap with said electronic element in the plan projection, at least one of the connection parts that are provided closest to angular parts of said electronic element is formed as said dummy connection part.