TEST METHOD OF MICROSTRUCTURE BODY AND MICROMACHINE

• US 20110006784A1
• Filed: 09/23/2010
• Published: 01/13/2011
• Est. Priority Date: 12/02/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamaguchi, Mayumi, Izumi, Konami, TATEISHI, Fuminori
• Granted Patent: US 8,558,555 B2
• Time in Patent Office: Days
• US Class Current: 324/637
• CPC Class Codes: B81C 99/004 during manufacturing
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT

Abstract

It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.

Claims

1. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:

connecting the first conductive layer to a first pad;

connecting the second conductive layer to a second pad;

supplying electric power to the microstructure body from the first pad and the second pad; and

detecting an electromagnetic wave generated from an antenna connected to the microstructure body as a characteristic of the microstructure body.

5. The method for testing a microstructure body according to claim 1, wherein the characteristic is selected from the group consisting of a thickness of the sacrifice layer, a height of the space, presence of the sacrifice layer, a spring constant of the microstructure body, a resonance frequency of the microstructure body, and a drive voltage of the microstructure body.

9. The method for testing a microstructure body according to claim 1, wherein the space is a region which is formed by removing the sacrifice layer.

13. A micromachine comprising a microstructure body which is tested by using the test method according to claim 1 and an electric circuit which is connected to the microstructure body.

2. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:

connecting the first conductive layer to a first pad;

connecting the second conductive layer to a second pad;

supplying electric power to the microstructure body wirelessly through an antenna connected to the microstructure body; and

detecting a voltage applied to the microstructure body or a current flowing in the microstructure body as a characteristic of the microstructure body from the first pad and the second pad.

6. The method for testing a microstructure body according to claim 2, wherein the characteristic is selected from the group consisting of a thickness of the sacrifice layer, a height of the space, presence of the sacrifice layer, a spring constant of the microstructure body, a resonance frequency of the microstructure body, and a drive voltage of the microstructure body.

10. The method for testing a microstructure body according to claim 2, wherein the space is a region which is formed by removing the sacrifice layer.

14. A micromachine comprising a microstructure body which is tested by using the test method according to claim 2 and an electric circuit which is connected to the microstructure body.

3. A method for testing a microstructure body, comprising the steps of:

connecting an antenna to a first microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer;

providing a second microstructure body having the same structure as that of the first microstructure body so as to be adjacent to the first microstructure body;

supplying electric power to the first microstructure body wirelessly through the antenna; and

detecting an electromagnetic wave generated from the antenna as a characteristic of the first microstructure body and evaluating a characteristic of the second microstructure body.

7. The method for testing a microstructure body according to claim 3, wherein the characteristic is selected from the group consisting of a thickness of the sacrifice layer, a height of the space, presence of the sacrifice layer, a spring constant of the microstructure body, a resonance frequency of the microstructure body, and a drive voltage of the microstructure body.

11. The method for testing a microstructure body according to claim 3, wherein the space is a region which is formed by removing the sacrifice layer.

15. A micromachine comprising a microstructure body which is tested by using the test method according to claim 3 and an electric circuit which is connected to the microstructure body.

4. A method for testing a microstructure body including a first conductive layer, a second conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer, comprising the steps of:

connecting the first conductive layer to a first pad;

connecting the second conductive layer to a second pad;

supplying electric power to the microstructure body from the first pad and the second pad; and

detecting a current flowing in the microstructure body as a characteristic of the microstructure body.

8. The method for testing a microstructure body according to claim 4, wherein the characteristic is selected from the group consisting of a thickness of the sacrifice layer, a height of the space, presence of the sacrifice layer, a spring constant of the microstructure body, a resonance frequency of the microstructure body, and a drive voltage of the microstructure body.

12. The method for testing a microstructure body according to claim 4, wherein the space is a region which is formed by removing the sacrifice layer.

16. A micromachine comprising a microstructure body which is tested by using the test method according to claim 4 and an electric circuit which is connected to the microstructure body.

17. A method for testing a microstructure body, comprising the steps of:

connecting a first antenna to a first microstructure body including a first conductive layer, a second conductive layer, layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer and having a known characteristic;

connecting a second microstructure body having the same structure as that of the first microstructure body to a second antenna having the same structure as that of the first antenna;

supplying electric power to the first microstructure body wirelessly through the first antenna;

detecting an electromagnetic wave generated from the first antenna as a reference characteristic of the second microstructure body;

supplying electric power to the second microstructure body wirelessly through the second antenna;

detecting an electromagnetic wave generated from the second antenna as a characteristic of the second the microstructure body; and

evaluating a characteristic of the second microstructure body by comparing the detected characteristic of the second microstructure body with the reference characteristic of the second microstructure body.

18. The method for testing a microstructure body according to claim 17, wherein a frequency or intensity of the electric power is changed, and intensity of the electromagnetic wave generated from the first antenna and the second antenna is detected as the characteristic in relation to a change in frequency or intensity of the electric power.

19. The method for testing a microstructure body according to claim 17, wherein the characteristic is selected from the group consisting of a thickness of the sacrifice layer, a height of the space, presence of the sacrifice layer, a spring constant of the first microstructure body, a resonance frequency of the first microstructure body, and a drive voltage of the first microstructure body.

20. The method for testing a microstructure body according to claim 17, wherein the characteristic is selected from the group consisting of a thickness of the sacrifice layer, a height of the space, presence of the sacrifice layer, a spring constant of the second microstructure body, a resonance frequency of the second microstructure body, and a drive voltage of the second microstructure body.

21. The method for testing a microstructure body according to claim 20, wherein the first microstructure body and the second microstructure body are provided over the same substrate.

22. The method for testing a microstructure body according to claim 20, wherein the first microstructure body and the second microstructure body are provided over different substrates.

23. The method for testing a microstructure body according to claim 20, wherein the space is a region which is formed by removing the sacrifice layer.

24. The method for testing a microstructure body according to claim 20, wherein the first conductive layer and the second conductive layer are provided in parallel.

25. A micromachine comprising a microstructure body which is tested by using the test method according to claim 20 and an electric circuit which is connected to the microstructure body.