CERAMIC ELECTRONIC COMPONENT

• US 20110007449A1
• Filed: 12/28/2009
• Published: 01/13/2011
• Est. Priority Date: 07/09/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: HUR, Kang Heon, SEO, Dong Hwan, KIM, Doo Young
• Granted Patent: US 8,174,816 B2
• Time in Patent Office: Days
• US Class Current: 361/321.2
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

There is provided a ceramic electronic component including a ceramic sintered body, internal conductive layers, and external electrodes. Each of the external electrodes includes a first electrode layer, a conductive resin layer covering the first electrode layer, and a second electrode layer covering the conductive resin layer and having an extension length greater than the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof. The distance from the top or bottom surface of the ceramic sintered body to the closest layer of the internal conductive layers is greater than or equal to the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof.

Claims

1. A ceramic electronic component comprising:

a ceramic sintered body having top and bottom surfaces and at least two side surfaces connecting the top and bottom surfaces;

internal conductive layers formed inside the ceramic sintered body; and

external electrodes electrically connected to the internal conductive layers,

wherein each of the external electrodes comprises a first electrode layer extending from one of the side surfaces of the ceramic sintered body to portions of the top and bottom surfaces thereof, a conductive resin layer covering the first electrode layer, and a second electrode layer covering the conductive resin layer and having an extension length greater than a length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof,

wherein a distance from the top or bottom surface of the ceramic sintered body to the closest layer of the internal conductive layers is greater than or equal to the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof.

2. The ceramic electronic component of claim 1, wherein the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof corresponds to 5% to 25% of the extension length of the second electrode layer.

3. The ceramic electronic component of claim 1, wherein the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof ranges from 25 μ

m to 125 μ

m.

4. The ceramic electronic component of claim 1, wherein the distance from the top or bottom surface of the ceramic sintered body to the closest layer of the internal conductive layers ranges from 40 μ

m to 150 μ

m.

5. The ceramic electronic component of claim 1, wherein the ceramic electronic component is a multi-layer chip capacitor,

wherein the ceramic sintered body is formed by laminating a plurality of ceramic dielectric layers,

the internal conductive layers comprise at least one pair of internal electrodes facing each other having one of the ceramic dielectric layers disposed therebetween and having different polarities, and

the external electrodes are connected to an end of one electrode of the pair of internal electrodes and an end of the other electrode of the pair of internal electrodes, respectively.