BACKLIGHT MODULE WITH A HEAT CONDUCTIVE BLOCK

• US 20110007521A1
• Filed: 09/13/2010
• Published: 01/13/2011
• Est. Priority Date: 12/23/2005
• Status: Active Grant

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Lo, Chi-chung, Hsieh, Chin-kun, Cheng, Chi-chen, Wu, Meng-chai, Lai, Cheng-chih
• Granted Patent: US 8,194,208 B2
• Time in Patent Office: Days
• US Class Current: 362/612
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133628 with cooling means

Abstract

A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.

Claims

1. A backlight module for use in an LCD, comprising:

a metal bezel having a bottom surface, a first edge surface perpendicular to the bottom surface, a second edge surface perpendicular to the bottom surface and the first edge surface, and a corner jointing the bottom surface, the first edge surface and the second edge surface;

a heat conductive block disposed at the corner;

a flexible circuit board disposed on the second edge surface of the metal bezel and the heat conductive block; and

a light emitting diode disposed on the flexible circuit board and corresponding to heat conductive block.

2. The backlight module of claim 1, wherein the light emitting diode comprises a light axis neither parallel nor perpendicular to the first edge surface and the second edge surface of the metal bezel.

3. The backlight module of claim 1, wherein the heat conductive block is a non-rectangle heat conductive block.

4. The backlight module of claim 1, wherein the heat conductive block, the flexible circuit board, and the metal bezel are adhered with a high polymer having high thermal conductivity.

5. The backlight module of claim 1, wherein the heat conductive block is attached to the metal bezel.

6. The backlight module of claim 1, wherein the heat conductive block directly contacts the bottom surface, the first edge surface, or the second edge surface.

7. A backlight module for use in an LCD, comprising:

a metal bezel having a first edge surface, a second edge surface perpendicular to the first edge surface, and a bottom surface connecting the first edge surface and the second edge surface;

a heat conductive block connecting a first area of the first edge surface;

a flexible circuit board having a first portion connecting the heat conductive block and a second portion laid on a second area of the second edge surface; and

a light emitting diode disposed on the first portion of the flexible circuit board, wherein the first portion of the flexible circuit board is connected between the heat conductive block and the light emitting diode, and the light emitting diode comprises a light axis neither parallel nor perpendicular to the first edge and the second edge of the bezel.

8. The backlight module according to claim 7, wherein the heat conductive block connects the second area of the second edge surface.

9. The backlight module according to claim 7, wherein the heat conductive block connects a contact area of the bottom surface.

10. The backlight module according to claim 7, wherein the second portion is parallel to the second area.

11. A backlight module for use in an LCD, comprising:

a metal bezel having a first edge surface, a second edge surface perpendicular to the first edge surface, and a bottom surface connecting the first edge surface and the second edge surface;

a heat conductive block connecting a contact area of the bottom surface;

a flexible circuit board having a first portion connecting the heat conductive block and a second portion laid on a second area of the second edge surface; and

a light emitting diode disposed on the first portion of the flexible circuit board, wherein the first portion of the flexible circuit board is connected between the heat conductive block and the light emitting diode, and the light emitting diode comprises a light axis neither parallel nor perpendicular to the first edge and the second edge of the bezel.

12. The backlight module according to claim 11, wherein the heat conductive block connects a first area of the first edge surface neither parallel nor vertical to the first portion.

13. A backlight module for use in an LCD, comprising:

a metal bezel having a first edge surface, a second edge surface perpendicular to the first edge surface, and a bottom surface connecting the first edge surface and the second edge surface;

a heat conductive block connecting a second area of the second edge surface;

a flexible circuit board having a first portion connecting the heat conductive block and a second portion laid on the second area of the second edge surface; and

a light emitting diode disposed on the first portion of the flexible circuit board, wherein the first portion of the flexible circuit board is connected between the heat conductive block and the light emitting diode, and the light emitting diode comprises a light axis neither parallel nor perpendicular to the first edge and the second edge of the bezel.