CONDENSATION AND CURING OF MATERIALS WITHIN A COATING SYSTEM

• US 20110008525A1
• Filed: 07/10/2009
• Published: 01/13/2011
• Est. Priority Date: 07/10/2009
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Erlat, Ahmet Gun, Dalakos, George Theodore, Heller, Christian Maria Anton
• Application Number:
  US12/501,308
• Publication Number:
  US 20110008525A1
• Time in Patent Office: Days
• US Class Current: 427/2.11
• CPC Class Codes: B05D 1/62 Plasma-deposition of organic layers plasma deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/0254 After-treatment
• CPC Class Codes: B05D 3/067 Curing or cross-linking the coating

Abstract

Present embodiments are directed to a system and method for condensing and curing organic materials within a deposition chamber. Present embodiments may include condensing an organic component from a gas phase into a liquid phase on a target surface within the deposition chamber, wherein the gas phase of the organic component might be mixed with an inert gas. Further, present embodiments may include solidifying the liquid phase of the organic component into a solid phase within the deposition chamber using an inert plasma formed from the inert gas.

Claims

1. A method for delivering, condensing and curing materials within a deposition chamber, comprising:

condensing material from a gas phase into a liquid phase on a target surface within the deposition chamber; and

solidifying the liquid phase of the material into a solid phase within the deposition chamber using a plasma.

2. The method of claim 1, wherein the material comprises an organic material.

3. The method of claim 1, comprising delivering the material into the deposition chamber in the gas phase along with an inert gas.

4. The method of claim 3, comprising forming the plasma from the inert gas.

5. The method of claim 1, wherein the deposition chamber comprises a plasma enhanced chemical vapor deposition chamber.

6. The method of claim 1, wherein solidifying the liquid phase comprises facilitating solidification of the liquid phase of the material into the solid phase with a thermal curing feature, or an ultra-violet light source, or an ultraviolet and visible light source disposed within the deposition chamber.

7. The method of claim 1, wherein the solid phase comprises a continuous or non-continuous coating over the target surface.

8. The method of claim 7, comprising depositing an inorganic coating on top of the coating formed by the solid phase.

9. The method of claim 1, comprising depositing a graded-composition barrier coating on a coating formed by the solid phase, wherein the graded-composition barrier coating comprises an inorganic and an organic material including a composition which varies substantially continuously across a thickness of the graded-composition barrier coating.

10. The method of claim 1, comprising heating non-target surfaces within the deposition chamber to a temperature sufficient to substantially limit condensation on the non-target surfaces.

11. The method of claim 1, comprising forming menisci in the liquid phase of the material to the adjacent surface features of the target surface and/or particles on the target surface.

12. The method of claim 1, comprising forming a smoothing and/or planarizing coating over structures or particles on the target surface, wherein a thickness of the coating is on the same order of magnitude or greater than a thickness of the structures or particles.

13. The method of claim 1, wherein solidifying the liquid phase of the material into the solid phase comprises forming a smoothing coating, and comprising forming a barrier coating over the smoothing coating.

14. The method of claim 1, wherein the material comprises radiation-curable alkenes and/or alkynes.

15. The method of claim 1, wherein the target surface comprises features of a glass, metal foil or plastic substrate, a plastic substrate with barrier, an optoelectronic device, an organic light emitting diode, a liquid crystal display, a photovoltaic device, an integrated circuit, a sensor, an electrochromic device, or a medical diagnostic device.

16. A system, comprising:

a deposition chamber;

an inlet system capable of supplying organic material as a vapor and an inert gas in the deposition chamber;

a condensation control system capable of controlling condensation of the organic material into a liquid phase on a target surface within the deposition chamber; and

a solidification feature capable of initiating curing and/or cross-linking of the liquid phase of the organic material into a solid phase within the deposition chamber.

17. The system of claim 16, wherein the deposition chamber comprises a hot-wall deposition chamber.

18. The system of claim 16, wherein the solidification feature comprises an ultra-violet light or an ultraviolet and visible light source.

19. The system of claim 16, wherein the inlet system is capable of delivering the organic material onto the target surface directly or indirectly regardless of line of sight.

20. The system of claim 16, wherein the inlet system comprises a showerhead, an injector, a mass flow controller, and/or a bubbler.

21. The system of claim 16, comprising a trap disposed along the inlet system before the hot-wall deposition chamber, wherein the trap is capable of being kept at a lower temperature than temperatures of non-target surfaces within the hot-wall deposition chamber.

22. A method comprising:

flowing a precursor vapor into a deposition chamber via a heated inlet system, wherein the precursor vapor comprises a material in a gas phase and an inert gas;

condensing the material into a stable liquid phase on a target surface of a component positioned on an electrode within the deposition chamber; and

solidifying the stable liquid phase of the material disposed on the target surface into a solid layer within the deposition chamber.

23. The method of claim 22, comprising solidifying the stable liquid phase of the material by activating an ultra-violet light disposed within the deposition chamber.

24. The method of claim 22, comprising solidifying the stable liquid phase of the material via exposure to a plasma within the deposition chamber, wherein the plasma is formed by ignition of the inert gas.

25. The method of claim 22, wherein the component comprises a glass, metal foil or plastic substrate, a plastic substrate with barrier, an optoelectronic device, an organic light emitting diode, a liquid crystal display, a photovoltaic device, an integrated circuit, a sensor, an electrochromic device, or a medical diagnostic device.

26. A method comprising:

forming a smoothing layer on a target, comprising;

condensing a material into a liquid phase on the target within the deposition chamber; and

solidifying the liquid phase of the material disposed on the target within the deposition chamber to form the smoothing layer; and

forming a barrier coating on the target within the deposition chamber.

27. The method of claim 26, comprising flowing a precursor vapor into the deposition chamber via a heated inlet system, wherein the precursor vapor comprises the material in a gas phase.

28. The method of claim 26, comprising forming the barrier coating on the smoothing layer.

29. The method of claim 26, comprising forming the smoothing layer on the barrier coating.

30. The method of claim 26, comprising:

forming the barrier coating over the smoothing layer; and

forming a second smoothing layer on the barrier coating, comprising;

condensing a second material into a liquid phase of the second material on the target within the deposition chamber; and

solidifying the liquid phase of the second material within the deposition chamber to form the second smoothing layer, wherein the second smoothing layer is configured for impact and/or abrasion resistance.

31. The method of claim 26, wherein the material comprises an organic material.