×

SYSTEMS AND METHODS FOR REAL-TIME MONITORING OF DIE USE OR YIELD

  • US 20110011224A1
  • Filed: 03/02/2009
  • Published: 01/20/2011
  • Est. Priority Date: 02/28/2008
  • Status: Abandoned Application
First Claim
Patent Images

1. A method for monitoring die cutting comprising the steps of:

  • a. placing at least one cutting die on a hide, each cutting die having a particular pattern and an RFID (Radio Frequency Identification) tag coupled thereto, each RFID tag containing die-related information about that particular cutting die;

    b. repeatedly reading at least one RFID tag to obtain the die-related information for each RFID tag in real-time;

    c. based on the obtained die-related information, determining whether the hide is ready for cutting;

    d. generating an output based on whether the hide is ready for cutting; and

    e. when the hide is ready for cutting, cutting the hide.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×