MULTILAYER CIRCUIT BOARD AND MOTOR DRIVE CIRCUIT BOARD

• US 20110011633A1
• Filed: 02/05/2009
• Published: 01/20/2011
• Est. Priority Date: 02/07/2008
• Status: Active Grant

• Current Assignee: Jtekt Corporation (Toyota Motor Corporation)
• Original Assignee: Jtekt Corporation (Toyota Motor Corporation)
• Inventors: Uchida, Nobuhiro, Nakai, Motoo, Sumasu, Hiroshi
• Granted Patent: US 8,288,658 B2
• Time in Patent Office: Days
• US Class Current: 174/258
• CPC Class Codes: B62D 5/0406 including housing for electronic control unit
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H02M 1/44 Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes
• CPC Class Codes: H05K 2201/10166 Transistor

Abstract

A multilayer circuit board in which wirings are arranged so that the inductance thereof is reduced. A ground wiring and a power source wiring which are provided in a multilayer circuit board are arranged so that most of the wirings are superposed vertically along a direction of a longer side of the circuit board, and since currents flow in an opposite direction to each other in the portions which are superposed, magnetic fields generated by the currents so flowing are canceled by each other. Similarly, a W-phase wiring, a V-phase wiring and a W-phase wiring are also arranged so that the wirings are partially superposed along their longer side direction vertically, and magnetic fields generated by currents flowing in the portions which are superposed vertically are canceled by one another. By this, the inductance of the wirings can be reduced by increasing a mutual inductance between these wirings.

Claims

1-5. -5. (canceled)

6. A multilayer circuit board including a plurality of conductor layers and a plurality of resin insulation layers which are laminated alternately, comprising:

a first wiring formed on a first layer of the plurality of conductor layers;

a second wiring formed on a second layer of the plurality of conductor layers;

a third wiring formed on a third layer of the plurality of conductor layers,

wherein portions of the first wiring and the second wiring which face each other in a laminated direction in which the plurality of conductor layers are laminated extend in parallel;

wherein the first wiring and the second wiring are arranged so as to weaken a magnetic field generated by a current which flows through the first wiring and a magnetic field generated by a current which flows through the second wiring to each other;

wherein the first wiring and the second wiring are a power source wiring and a ground wiring in which currents flow therethrough in an opposite direction to each other; and

wherein the first wiring, the second wiring, and the third wiring are respectively connected to phases of a multiphase motor provided outside.

7. The multilayer circuit board according to claim 6, wherein the first wiring, the second wiring, and the third wiring are respectively connected to the phases of the multiphase motor via a U-phase wiring, a V-phase wiring, and a W-phase wiring;

wherein an FET, a ground terminal, and a power source terminal are provided on the third layer;

wherein the ground wiring formed on the second layer is connected to the ground terminal via a through hole of the third layer;

wherein the power source wiring formed on the first layer is connected to the power source terminal via a through hole of the second layer;

wherein the U-phase wiring, the V-phase wiring, and the W-phase wiring have layer shapes, and are provided on the first layer, the second layer, and the third layer, respectively; and

wherein portions of the U-phase wiring, the V-phase wiring and the W-phase wiring are superposed in the laminated direction of the plurality of conductor layers.

8. The multilayer circuit board according to claim 6, further comprising:

a terminal provided in a vicinity of at least one of two short edges of four edges of a substrate surface which is configured by curved lines or straight lines, and is connected to at least one of the first wiring and the second wiring,

wherein the portions of the first wiring and the second wiring which face each other extend along two long edges of the four edges.

9. A motor drive circuit board for an electric power steering system, comprising:

a multilayer circuit board which includes a plurality of conductor layers and a plurality of resin insulation layers, the conductor layers and the resin insulation layers being laminated alternately;

a first wiring formed on a first layer of the plurality of conductor layers;

a second wiring formed on a second layer of the plurality of conductor layers; and

a third wiring formed on a third layer of the plurality of conductor layers,

wherein portions of the first wiring and the second wiring which face each other in a laminated direction in which the plurality of conductor layers are laminated extend in parallel;

wherein the first wiring and the second wiring are arranged so as to weaken a magnetic field generated by a current which flows through the first wiring and a magnetic field generated by a current which flows through the second wiring to each other;

wherein the first wiring and the second wiring are a power source wiring and a ground wiring in which currents flow therethrough in an opposite direction to each other; and

wherein the first wiring, the second wiring, and the third wiring are respectively connected to phases of a multiphase motor provided outside.

10. The motor drive circuit board according to claim 9, wherein the first wiring, the second wiring, and the third wiring are respectively connected to the phases of the multiphase motor via a U-phase wiring, a V-phase wiring, and a W-phase wiring;

wherein an FET, a ground terminal, and a power source terminal are provided on the third layer;

wherein the ground wiring formed on the second layer is connected to the ground terminal via a through hole of the third layer;

wherein the power source wiring formed on the first layer is connected to the power source terminal via a through hole of the second layer;

wherein the U-phase wiring, the V-phase wiring, and the W-phase wiring have layer shapes, and are provided on the first layer, the second layer, and the third layer, respectively; and

wherein portions of the U-phase wiring, the V-phase wiring, and the W-phase wiring are superposed in the laminated direction of the plurality of conductor layers.