Plasma Gun and Plasma Gun Deposition System Including the Same

• US 20110011734A1
• Filed: 08/29/2006
• Published: 01/20/2011
• Est. Priority Date: 03/01/2006
• Status: Abandoned Application

• Current Assignee: Shinmaywa Industries Limited
• Original Assignee: Shinmaywa Industries Limited
• Inventors: Tsuchiya, Takayuki, Marunaka, Masao, Terakura, Atsuhiro
• Application Number:
  US12/281,312
• Publication Number:
  US 20110011734A1
• Time in Patent Office: Days
• US Class Current: 204/192.11
• CPC Class Codes: C23C 14/32 by explosion; by evaporation and subsequent ionisation of the vapours , e.g. ion-platingC23C14/34 - C23C14/48 take precedence
• CPC Class Codes: H01J 37/32431 Constructional details of the reactor
• CPC Class Codes: H05H 1/54 Plasma accelerators

Abstract

A plasma gun of the present invention includes: a container having a plasma outflow opening; a cathode (18) which is disposed inside the container to generate plasma by discharge; an auxiliary anode which is disposed to be able to be located between the plasma outflow opening and the cathode and is able to receive the plasma generated by the cathode; an exhaust valve for exhausting air from and sealing an inside of the container; and a plasma flow-out preventing/allowing device which prevents the plasma, having been generated by the discharge of the cathode, from flowing out from the plasma outflow opening and allows the plasma to flow out from the plasma.

Claims

1. (canceled)

2. (canceled)

3. (canceled)

4. (canceled)

5. (canceled)

6. A plasma gun deposition system comprising:

a plasma gun including a container having a plasma outflow opening, a cathode which is disposed inside the container to generate plasma by discharge, and an exhaust valve for exhausting air from and sealing the container;

a deposition chamber which includes a plasma inflow opening, is disposed such that an inside thereof is in communication with an inside of the container through the plasma inflow opening and the plasma outflow opening, and is capable of reducing pressure of the inside thereof;

an auxiliary anode which is disposed to be able to be located between the plasma inflow opening and the cathode and is able to receive the plasma generated by the cathode;

a plasma flow-out preventing/allowing device which prevents the plasma, having been generated by the discharge of the cathode, from flowing in from the plasma inflow opening and allows the plasma to flow in from the plasma inflow opening; and

a main anode disposed inside the deposition chamber;

a magnet coil disposed between the cathode and the anode to allow the plasma to pass therethrough;

a DC power supply whose negative terminal is connected to the cathode; and

a selecting switch which selectively connects a positive terminal of the DC power supply with main anode and the auxiliary anode.

7. The plasma gun deposition system according to claim 6, wherein:

a substrate holder and a hearth which stores and vaporizes a deposition material are disposed inside the deposition chamber;

the hearth constitutes the main anode; and

the deposition material stored in the hearth is vaporized by the plasma received by the hearth, and is formed into a film on a substrate held by the substrate holder.

8. The plasma gun deposition system according to claim 6, further comprising:

a sheet plasma deforming chamber disposed between the container and the deposition chamber; and

a sheet plasma deforming mechanism, wherein;

the sheet plasma deforming chamber is disposed to be communicated with the inside of the deposition chamber via the plasma inflow opening and to be communicated with the inside of the container via the plasma outflow opening;

the plasma gun is configured such that columnar plasma is generated in the container and flows out from the plasma outflow opening;

the flow-out columnar plasma is deformed into sheet plasma in the sheet plasma deforming chamber by the sheet plasma deforming mechanism; and

a film is formed in the deposition chamber by utilizing the sheet plasma flowed from the sheet plasma deforming chamber toward the main anode.

9. The plasma gun deposition system according to claim 6, wherein:

the plasma flow-out preventing/allowing device includes an opening/closing member capable of opening and closing the plasma outflow opening and a driving device which causes the opening/closing member to open and close, and

the auxiliary anode is formed to be annular.

10. The plasma gun deposition system according to claim 9, wherein the auxiliary anode is disposed between the cathode and the opening/closing member.

11. The plasma gun deposition system according to claim 6, wherein:

the plasma flow-out preventing/allowing device includes an opening/closing member capable of opening and closing the plasma outflow opening and a driving device which causes the opening/closing member to open and close, and

the auxiliary anode is disposed at the opening/closing member so as to face the cathode in a state where the opening/closing member closes the plasma outflow opening.

12. A method for operating a plasma gun deposition system comprising:

a plasma gun including a container having a plasma outflow opening, a cathode which is disposed inside the container to generate plasma by discharge, and an exhaust valve for exhausting air from and sealing the container;

a deposition chamber which includes a plasma inflow opening, is disposed such that an inside thereof is in communication with an inside of the container through the plasma inflow opening and the plasma outflow opening, and is capable of reducing pressure of the inside thereof;

an auxiliary anode which is disposed to be able to be located between the plasma inflow opening and the cathode and is able to receive the plasma generated by the cathode;

a plasma flow-out preventing/allowing device which prevents the plasma, having been generated by the discharge of the cathode, from flowing in from the plasma inflow opening and allows the plasma to flow in from the plasma inflow opening;

a main anode disposed inside the deposition chamber;

a magnet coil disposed between the cathode and the anode to allow the plasma to pass therethrough;

a DC power supply whose negative terminal is connected to the cathode; and

a selecting switch which selectively connects a positive terminal of the DC power supply with the main anode and the auxiliary anode, the method comprising the steps of;

preventing by the plasma flow-out preventing/allowing device the plasma, having been generated by the cathode, from flowing in from the plasma inflow opening and connecting by the selecting switch the positive terminal of the DC power supply with the auxiliary anode;

generating the plasma by the cathode to receive the generated plasma by the auxiliary anode; and

allowing by the plasma flow-out preventing/allowing device/be plasma, having been generated by the cathode, to flow in from the plasma inflow opening and connecting by the selecting switch the positive terminal of the DC power supply with the main anode.