STRUCTURE OF AC LIGHT-EMITTING DIODE DIES

• US 20110012137A1
• Filed: 08/23/2010
• Published: 01/20/2011
• Est. Priority Date: 08/31/2004
• Status: Active Grant

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Epistar Corporation (Ennostar, Inc.), Industrial Technology Research Institute
• Inventors: LIN, Ming-Te, Kuo, Chia-Tai, Hwang, Fei-Chang
• Granted Patent: US 8,803,166 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

Claims

1. An arrangement of light emitting diodes, comprising:

a substrate; and

four adjoining light-emitting units on said substrate, each unit comprising at least one micro-die, each micro-die comprising a lower semiconductor layer of first conductivity on said substrate, an upper semiconductor layer of second conductivity on said lower semiconductor layer, and two connecting portions on the lower semiconductor layer and the upper semiconductor layer respectively;

wherein the four adjoining light-emitting units comprise a first group of connecting portions comprising four connecting portions disposed substantially at the center of the four adjoining light-emitting units, and a second group of connecting portions comprising another four connecting portions disposed substantially at the periphery of the four adjoining light-emitting units.

2. The arrangement of claim 1, wherein the substrate comprises two bonding pads disposed at two opposite ends of the substrate.

3. The arrangement of claim 1, wherein the four adjoining light-emitting units on the substrate are connected serially between said the two bonding pads.

4. The arrangement of claim 1, wherein each of the four adjoining light-emitting unit comprises two micro-dies in anti-parallel connection.

5. The arrangement of claim 1, wherein the connecting portion is a cathode or an anode of the micro-die.

6. An arrangement of light emitting diodes, comprising:

a substrate; and

four micro-dies on said substrate, each micro-die comprising a lower semiconductor layer of first conductivity on said substrate, an upper semiconductor layer of second conductivity on said lower semiconductor layer, two connecting portions on the lower semiconductor layer and the upper semiconductor layer respectively;

wherein the four micro-dies comprise a first group of connecting portions comprising four connecting portions disposed substantially at the center of the four micro-dies, and a second group of connecting portions comprising another four connecting portions disposed substantially at four corners of the four micro-dies respectively.

7. The arrangement of claim 6, wherein the substrate comprises two bonding pads disposed at two opposite ends of the substrate.

8. An arrangement of light emitting diodes, comprising:

a substrate;

at least two serial arrays formed on said substrate connected in anti-parallel;

each array having a plurality of light emitting diodes connected serially; and

each light emitting diode comprising a lower semiconductor layer of first conductivity on said substrate, an upper semiconductor layer of second conductivity on said lower semiconductor layer, a lower connecting portion on the lower semiconductor layer and an upper connecting portion on the upper semiconductor layer, said upper and lower connecting portions being disposed on diagonally opposite corners.

9. The arrangement of claim 8, wherein at least one of the light emitting diodes in one array is electrically connected to a corresponding light emitting diode in another array.

10. A structure of light-emitting diode, comprising:

a substrate;

four micro-dies positioned on said substrate; and

a crossing surrounded by said four micro-dies;

wherein each of said four micro-dies comprises a lower semiconductor layer, an upper semiconductor layer, an anode, and a cathode;

wherein either said anode or said cathode is nearby said crossing.