Light-Emitting Diode Die Packages and Methods for Producing Same

• US 20110012138A1
• Filed: 09/27/2010
• Published: 01/20/2011
• Est. Priority Date: 02/06/2009
• Status: Active Grant

• Current Assignee: Evergrande Holdings Limited
• Original Assignee: Evergrande Holdings Limited
• Inventors: Wang, Tsung-Chi, SHEN, Yu-Nung
• Granted Patent: US 8,563,963 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder.

Claims

1. A light-emitting diode die package, comprising:

a light-emitting diode (LED) die including a semiconductor base having an electrode-mounting surface, at least two electrodes disposed on the electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the corresponding electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the corresponding through holes of the insulation layer, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes; and

a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die, the covering layer being made of a transparent material doped with phosphor powder.

2. The light-emitting diode die package according to claim 1, further comprising at least two bodies made of an electrically conductive material and extending from the corresponding conductor units to the covering layer that defines the outer surface of the LED die, the respective electrically conductive bodies having a surface area substantially greater than that of the corresponding one of the conductor units.

3. The light-emitting diode die package according to claim 2, further comprising at least one additional LED die connected in series or in parallel to the LED die through the electrically conductive bodies.

4. The light-emitting diode die package according to claim 2, further comprising a solder ball disposed between one of the conductor units and a corresponding one of the electrically conductive bodies.

5. The light-emitting diode die package according to claim 1, wherein the conductor units are made of at least two materials.

6. The light-emitting diode die package according to claim 5, wherein the respective conductor units comprise at least one conductor layer made by anyone of copper, diamond-graphite, silicon carbide, aluminum, zinc, silver and like materials, a conductor layer made by nickel or a like material, and a conductor layer made by gold or a like material.

7. A method for producing a light-emitting diode die package, comprising the steps of:

providing a plurality of light-emitting diode (LED) dies, each including a semiconductor base having an electrode-mounting surface, at least two electrodes disposed on the electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the corresponding electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the corresponding through holes of the insulation layer, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes;

arranging the LED dies in an array on a supporting surface of a support;

forming a transparent covering layer on the supporting surface of the support in a manner covering all of the LED dies, wherein the covering layer is doped with phosphor powder; and

dicing the covering layer to obtain a plurality of LED die packages, each comprising at least one LED die.

8. The method for producing a light-emitting diode die package according to claim 7, further comprising, before the step of dicing the covering layer, a step of forming a protective layer on a surface of the covering layer which is flush with the conductor units, so as to cover all of the conductor units, wherein the protective layer is formed with a plurality of exposure holes that expose the corresponding conductor units and have a greater dimension than that of the corresponding conductor units;

and a step of filling an electrically conductive material in the exposure holes.

9. The method for producing a light-emitting diode die package according to claim 8, wherein in the step of forming the protective layer, the exposure holes of the protective layer are formed to expose the conductor units that correspond to the electrodes having either the same or the opposite polarity and residing in at least two neighboring LED dies, so that the at least two neighboring LED dies are electrically connected either in parallel or in series through the electrically conductive material, whereby an LED module composed of at least two LED dies is obtained after the dicing step, which has a voltage rating of either AC/DC 100-130V or AC/DC 200-240V.

10. The method for producing a light-emitting diode die package according to claim 8, wherein in the step of providing the LED dies, each of the LED dies is further provided with two solder balls disposed on the corresponding conductor units.

11. The method for producing a light-emitting diode die package according to claim 7, wherein in the step of forming the conductor units, the respective conductor units are made of at least two materials.

12. The method for producing a light-emitting diode die package according to claim 11, wherein in the step of forming the conductor units, the respective conductor units comprise at least one conductor layer made by anyone of copper, diamond-graphite, silicon carbide, aluminum, zinc, silver and like materials, a conductor layer made by nickel or a like material, and a conductor layer made by gold or a like material.

13. A method for producing a light-emitting diode die package, comprising the steps of:

providing a light-emitting diode (LED) wafer including a plurality of LED dies, each including a semiconductor base having an electrode-mounting surface and at least two electrodes disposed on the electrode-mounting surface of the semiconductor base;

dicing the LED wafer, such that a gap is generated between every two neighboring LED dies, whereby a continuous metal layer present among the neighboring LED dies is divided;

forming an insulation layer on the electrode-mounting surface of the LED die, the insulation layer being transparent to light and doped with phosphor powder and formed with a plurality of through holes that expose the corresponding electrodes and have a greater dimension than that of the corresponding electrodes;

forming a conductor unit inside of the respective through holes, so that the respective conductor units are electrically conducted to the corresponding electrodes;

subjecting a surface of the LED wafer opposite to the electrode-mounting surface to dicing, and further coating the surface with a phosphor powder layer, so that the phosphor powder layer is connected to the insulation layer formed within the gap; and

dicing the LED wafer to obtain a plurality of LED die packages, each comprising at least one LED die.

14. The method for producing a light-emitting diode die package according to claim 13, wherein in the step of forming the insulation layer, the exposure holes of the insulation layer are formed to expose the conductor units that correspond to the electrodes having either the same or the opposite polarity and residing in at least two neighboring LED dies, so that the at least two neighboring LED dies are electrically connected either in parallel or in series through the electrically conductive material, whereby an LED module composed of at least two LED dies is obtained after the dicing step, which has a voltage rating of either AC/DC 100-130V or AC/DC 200-240V.