Conductive Heating

• US 20110012632A1
• Filed: 07/15/2010
• Published: 01/20/2011
• Est. Priority Date: 07/15/2009
• Status: Active Grant

• Current Assignee: Teradyne Incorporated
• Original Assignee: Teradyne Incorporated
• Inventors: Merrow, Brian S., Akers, Larry W.
• Granted Patent: US 8,547,123 B2
• Time in Patent Office: Days
• US Class Current: 324/750.03
• CPC Class Codes: G11B 19/048 Testing of disk drives, e.g. to detect defects or prevent sudden failure
• CPC Class Codes: G11B 5/4555 by using a spin-stand, i.e. a spinning disc or simulator
• CPC Class Codes: G11B 5/5565 system adaptation for compensation of variations of physical parameters, e.g. temperature

Abstract

A test slot assembly is provided for testing a storage device. The test slot assembly is configured to receive and support a storage device, or a storage device supported by a storage device transporter. The test slot assembly also includes a conductive heating assembly. The conductive heating assembly is arranged to heat a storage device by way of thermal conduction.

Claims

1. A test slot assembly comprising:

a housing configured to receive and support a storage device, and

a conductive heating assembly associated with the housing and arranged to heat the storage device by way of thermal conduction.

2. The test slot assembly of claim 1, wherein the conductive heating assembly comprises one or more electric heating elements.

3. The test slot assembly of claim 2, wherein the one or more electric heating elements comprise one or more resistive heaters.

4. The test slot assembly of claim 2, wherein the conductive heating assembly comprises printed circuitry, wherein the printed circuitry comprises one or more electrically conductive layers, and wherein the one or more electric heating elements are integrated in the one or more electrically conductive layers.

5. The test slot assembly of claim 4, wherein the printed circuitry comprises a printed wiring board.

6. The test slot assembly of claim 4, wherein the printed circuitry comprises a flexible printed circuit.

7. The test slot assembly of claim 1, further comprising:

a clamping mechanism operatively associated with the housing,

wherein the clamping mechanism is operable to move the conductive heating assembly into contact with a storage device.

8. The test slot assembly of claim 7, wherein the test slot assembly further comprises a temperature sensor arranged to measure a temperature of the storage device.

9. The test slot assembly of claim 8, wherein the clamping mechanism is operable to move the temperature sensor into contact with a storage device.

10. The test slot assembly of claim 8, wherein the temperature sensor comprises a thermocouple.

11. The test slot assembly of claim 1, further comprising a storage device transporter supporting the storage device.

12. The test slot assembly of claim 11, wherein the housing is configured to receive and support the storage device transporter.

13. A storage device testing system comprising:

A.) a test slot comprising;

i.) a test compartment for receiving and supporting a storage device;

ii.) a conductive heating assembly associated with the test compartment and arranged to heat the storage device by way of thermal conduction; and

B.) test electronics configured to communicate one or more test routines to the storage device disposed within the test compartment.

14. The storage device testing system of claim 13, wherein the test slot further comprises a connection interface board configured to provide electrical communication with the test electronics, and wherein the test electronics are configured to control a current flow to the conductive heating assembly.

15. The storage device testing system of claim 13, wherein the test slot further comprises a connection interface board configured to control a current flow to the conductive heating assembly.

16. The storage device testing system of claim 13, wherein the test compartment further comprises a temperature sensor arranged to measure a temperature of the storage device.

17. The storage device testing system of claim 16, wherein the test slot further comprises a connection interface board configured to provide electrical communication between the temperature sensor and the test electronics and configured to control a current flow to the conductive heating assembly based, at least in part, on signals received from the temperature sensor.

18. The storage device testing system of claim 16 wherein the test electronics are configured to measure a power draw of the storage device and compensate for any error between an actual temperature of the storage device and a temperature measured by the temperature sensor.

19. The storage device testing system of claim 13, wherein the test slot further comprises a connection interface board configured to provide electrical communication with the conductive heating assembly when the storage device is disposed within the test compartment.

20. A method comprising:

inserting a storage device into a test compartment of a test slot; and

engaging a clamping mechanism to both clamp the storage device within the test compartment of the test slot and move a conductive heating assembly into physical contact with the storage device.