Providing in package power supplies for integrated circuits

• US 20110012670A1
• Filed: 09/23/2010
• Published: 01/20/2011
• Est. Priority Date: 04/01/2002
• Status: Abandoned Application

• Current Assignee: Duane R. Mills, Steven R. Eskildsen
• Original Assignee: Duane R. Mills, Steven R. Eskildsen
• Inventors: Eskildsen, Steven R., Mills, Duane R.
• Application Number:
  US12/888,888
• Publication Number:
  US 20110012670A1
• Time in Patent Office: Days
• US Class Current: 327/530
• CPC Class Codes: G11C 16/30 Power supply circuits
• CPC Class Codes: G11C 5/147 Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops G11C5/141 takes precedence
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19104 on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor

Abstract

A device with an in package power supply may be utilized to supply power to other components. As a result, the overall system size may be reduced and economies may be achieved.

Claims

1. A method comprising:

supplying power to an integrated circuit using a power supply in a package with the integrated circuit; and

selectively supplying power to a component from the power supply external to the package when the integrated circuit is not in operation, using a lower supply voltage than said integrated circuit.

2. The method of claim 1 wherein supplying power to an integrated circuit comprises supplying power to a memory.

3. The method of claim 1 wherein supplying power to a component comprises supplying power to a memory.

4. The method of claim 1 wherein supplying power to a component comprises supplying power to a component on a board on which the integrated circuit and the power supply are mounted.

5. The method of claim 1 wherein the package is a first package and wherein supplying power to a component comprises supplying power to an integrated circuit in a second package separate from the first package.