MODULAR HIGH-POWER DRIVE STACK COOLED WITH VAPORIZABLE DIELECTRIC FLUID
First Claim
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1. A high power drive stack system comprising:
- a common support structure including;
a system power source,a dielectric fluid cooling system, anda plurality of receivers located in predetermined locations,wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;
at least one module including;
a power component,a dielectric fluid cooling circuit associated with the power component, andat least two module connectors,wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and
each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure.
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Abstract
A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors (210). Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
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Citations
19 Claims
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1. A high power drive stack system comprising:
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a common support structure including; a system power source, a dielectric fluid cooling system, and a plurality of receivers located in predetermined locations, wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers; at least one module including; a power component, a dielectric fluid cooling circuit associated with the power component, and at least two module connectors, wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A cooling and power system comprising:
a vaporizable dielectric fluid cooling system having an evaporator positioned to cool at least one power silicon device, at least portions of a fluid conduit of the vaporizable dielectric fluid cooling system also providing an electrical connection to the power silicon device.
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18. A connector comprising:
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a plug and mating socket, the plug and socket are formed at least in part as a hollow tube, at least a portion of the tube being conductive along its length, the plug and socket constructed to make an electrical connection between the plug and socket; the plug and socket constructed to make a fluid connection between the plug and socket.
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19. A method of cooling and powering a silicon device comprising the steps of:
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providing a power silicon device cooling the power silicon device by providing a cooling system utilizing a vaporizable dielectric refrigerant, the system comprising a plurality of fluid conduits, a pump, a condenser, and a cold plate, wherein the cold plate is positioned for cooling the power silicon device by promoting the vaporization of liquid refrigerant passing through the cold plate; providing a source of power; powering the silicon device by electrically connecting the source of power to the power silicon device utilizing at least a portion of the fluid conduit.
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Specification