MEMS MICROPHONE PACKAGE AND MEHTOD FOR MAKING SAME

• US 20110013787A1
• Filed: 10/30/2009
• Published: 01/20/2011
• Est. Priority Date: 07/16/2009
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: CHANG, JEN-TSORNG
• Application Number:
  US12/609,130
• Publication Number:
  US 20110013787A1
• Time in Patent Office: Days
• US Class Current: 381/174
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003

Abstract

An exemplary micro-electro-mechanical systems (MEMS) microphone package includes a first substrate, a second substrate opposite to the first substrate, and a microphone chip disposed on the second substrate. First through holes are defined in the first substrate. Conductive material is disposed in each first through hole. A through hole is defined in the second substrate. Contact pads are disposed on the second substrate. Each contact pad connects the corresponding electrically conductive material in each first through hole. The microphone chip is surrounded by the contact pads. When sound waves transmit through the through hole in the second substrate to the microphone chip, the microphone chip converts sound into an electrical signal.

Claims

1. A MEMS (micro-electrical-mechanical systems) microphone package comprising:

a first substrate having a plurality of first through holes defined therein, and an electrically conductive material disposed in each first through hole;

a second substrate opposite to the first substrate, the second substrate having a through hole defined therein, a plurality of contact pads disposed on the second substrate, each contact pad electrically connected with the corresponding electrically conductive material; and

a microphone chip disposed on the second substrate, the microphone chip surrounded by the contact pads.

2. The MEMS microphone package of claim 1, wherein the first substrate further comprises a plurality of second through holes defined therein, the microphone chip faces the second through holes, and the second through holes are configured for venting sound outside.

3. The MEMS microphone package of claim 1, wherein the first through holes are defined in the periphery of the first substrate.

4. The MEMS microphone package of claim 1, wherein the MEMS microphone package further comprises a plurality of bulk solders, and each bulk solder is disposed on the electrically conductive material of the respective first through hole.

5. The MEMS microphone package of claim 1, wherein the microphone chip comprises a diaphragm, an isolation layer, and a back plate, the isolation layer is disposed on the substrate, the back plate is disposed on the isolation layer, the diaphragm is above and substantially parallel with the back plate, a through hole is defined in the isolation layer and the back plate, and the through hole communicates with the through hole in the second substrate.

6. A MEMS microphone package comprising:

a first substrate having a plurality of first through holes defined in the periphery thereof, and an electrically conductive material disposed in each first through hole;

a second substrate opposite to the first substrate, a through hole defined in the second substrate, a plurality of contact pads disposed on the second substrate, a solder ball electrically connected between each contact pad and the corresponding electrically conductive material; and

a microphone chip disposed on the second substrate, the microphone chip surrounded by the contact pads.

7. A method for making a MEMS microphone package, the method comprising:

forming a plurality of first through holes in a first substrate;

filling each first through hole with an electrically conductive material;

providing a second substrate, the second substrate opposite to the first substrate;

forming a microphone chip on a surface of the second substrate, the microphone chip facing the first substrate;

forming a through hole in the second substrate, the microphone chip covering the through hole in the second substrate;

forming a plurality of contact pads on the surface of the second substrate, the contact pads surrounding the microphone chip; and

electrically connecting the electrically conductive material in the first through holes with the corresponding contact pads.

8. The method of claim 7, wherein the conductive material in each first through hole connects the corresponding contact pad via a solder ball.

9. The method of claim 7, further comprising forming a plurality of second through holes in the first substrate, for venting sound outside.

10. The method of claim 7, wherein forming the microphone chip comprising:

forming an isolation layer on the surface of the second substrate;

forming a back plate on the isolation layer;

forming a through hole in the back plate and the isolation layer; and

forming a vibrating member on the surface of the second substrate, the vibrating member comprising a diaphragm and a supporting unit extends from opposite ends of the diaphragm respectively to the surface of the second substrate.

11. The method of claim 10, further comprising forming two electrodes on the diaphragm and the back plate respectively.

12. The method of claim 7, wherein the first through holes is formed by a deep reactive ion etching (DRIE) process.