METHOD AND DISPERSION FOR APPLYING A METAL LAYER TO A SUBSTRATE AND METALLIZABLE THERMOPLASTIC MOLDING COMPOUND

• US 20110014492A1
• Filed: 03/13/2009
• Published: 01/20/2011
• Est. Priority Date: 03/13/2008
• Status: Abandoned Application

• Current Assignee: BASF SE
• Original Assignee: BASF SE
• Inventors: Joshi, Ketan, Kieburg, Christoffer, Hermes, Stephan, Wagner, Norbert
• Application Number:
  US12/922,421
• Publication Number:
  US 20110014492A1
• Time in Patent Office: Days
• US Class Current: 428/626
• CPC Class Codes: C23C 18/1641 Organic substrates, e.g. resin, plastic
• CPC Class Codes: C23C 18/2053 only one step pretreatment
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C25D 5/54 Electroplating of non-metallic surfaces C25D7/12 takes precedence
• CPC Class Codes: C25D 5/56 of plastics
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/188 by direct electroplating
• CPC Class Codes: H05K 3/387 for electroless plating H05K3/4661 takes precedence
• CPC Class Codes: Y10T 428/12569 Synthetic resin
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

The process for the application of a metal layer on a substrate by deposition of a metal from a metal salt solution comprises the presence of exfoliated graphite in the substrate surface.

Claims

1-25. -25. (canceled)

26. A process for the application of a metal layer on a substrate by deposition of a metal from a metal salt solution, which comprises the presence of exfoliated graphite in the substrate surface.

27. The process according to claim 26, wherein the surface area of the exfoliated graphite is from 300 to 2600 m²/g.

28. The process according to claim 26, wherein the substrate comprises a thermoplastic molding composition, where the thermoplastic molding composition comprises, based on the total weight of components A, B, C, and D, which gives a total of 100% by weight,

a from 20 to 99% by weight of a thermoplastic polymer as component A,

b from 1 to 30% by weight of exfoliated graphite as component B,

c from 0 to 10% by weight of a dispersing agent as component C, and

d from 0 to 40% by weight of fibrous or particulate fillers, or a mixture of these, as component D,

or, based on the total weight of components A, B, C, D, and E, which gives a total of 100% by weight,

a from 20 to 98% by weight of a thermoplastic polymer as component A,

b from 1 to 30% by weight of exfoliated graphite as component B,

c from 1 to 70% by weight of electrically conductive particles whose average particle diameter is from 0.01 to 100 μ

m as component C,

d from 0 to 10% by weight of a dispersing agent as component D, and

e from 0 to 40% by weight of fibrous or particulate fillers, or a mixture of these, as component E.

29. The process according to claim 28, wherein the component A used comprises one or more polymers selected from the group of impact-modified vinylaromatic copolymers, of thermoplastic elastomers based on styrene, of polyolefins, of polycarbonates, of polyamides, of polyvinyl chloride, of polyesters, of epoxy resins, and of thermoplastic polyurethanes, and also of mixtures of these.

30. The process according to claim 26, wherein the substrate is provided with a dispersion, and the dispersion is at least partially dried and/or at least partially hardened, and after the at least partial drying and/or at least partial hardening of the dispersion, deposition of the metal takes place by a chemical and/or electroplating method, and the dispersion here comprises

a′

from 0.1 to 99.9% by weight, based on the total weight of components A′

, B′

, and C′

, of an organic binder component A′

,

b′

from 0.1 to 30% by weight, based on the total weight of components A′

, B′

, and C′

, of exfoliated graphite as component B′

,

c′

from 0 to 99.8% by weight, based on the total weight of components A′

, B′

, and C′

, of a solvent component C′

and moreover, if appropriate, at least one of the following components;

d′

from 0.1 to 50% by weight, based on the total weight of components A′

, B′

, and C′

, of a dispersing agent component D′

, and also e′

from 0.1 to 50% by weight, based on the total weight of components A′

, B′

, and C′

, of a filler component E′

or

a from 0.1 to 99.8% by weight, based on the total weight of components A, B, C, and D, of an organic binder component A

b from 0.1 to 30% by weight, based on the total weight of components A, B, C, and D, of exfoliated graphite as component B,

c from 0.1 to 70% by weight, based on the total weight of components A, B, C, and D, of electrically conductive particles whose average particle diameter is from 0.01 to 100 μ

m as component C,

d from 0 to 99.7% by weight, based on the total weight of components A, B, C, and D, of a solvent component D, and moreover, if appropriate, at least one of the following components;

e from 0.1 to 20% by weight, based on the total weight of components A, B, C, and D, of a dispersing agent component E, and also

f from 0.1 to 40% by weight, based on the total weight of components A, B, C, and D, of an additive F.

31. The process according to claim 30, wherein the binder component A′

is composed of a polymer or polymer mixture.

32. The process according to claim 30, wherein the dispersion is applied in structured or non-structured form to the substrate.

33. The process according to claim 26, wherein the substrate surface comprising exfoliated graphite is surface-activated before a chemical and/or electroplating method is used for deposition of a metal.

34. A substrate surface at least partially comprising an electrically conductive metal layer obtainable from the processes according to claim 26.

35. A thermoplastic molding composition for the production of moldings that can be metallized by a currentless and/or electroplating method, comprising, based on the total weight of components A, B, C, D, and E, which gives a total of 100% by weight,

a from 20 to 98% by weight of a thermoplastic polymer as component A,

b from 1 to 30% by weight of exfoliated graphite as component B,

c from 1 to 70% by weight of electrically conductive particles whose average particle diameter is from 0.01 to 100 μ

m as component C,

d from 0 to 10% by weight of a dispersing agent as component D, and

e from 0 to 40% by weight of fibrous or particulate fillers, or a mixture of these, as component E.

36. The thermoplastic molding composition according to claim 35, wherein the component C used comprises metal powder.

37. A process for the production of moldings metallized by a currentless and/or electroplating method, which comprises mixing the thermoplastic molding compositions according to claim 35 in the melt, and then extruding or injection-molding them, and then, if appropriate, carrying out one or more further shaping processes, and finally depositing a metal layer from a metal salt solution by a currentless and/or electroplating method, where if appropriate prior to the metal deposition by a currentless and/or electroplating method a surface of the thermoplastic molding compositions is activated.

38. A metallized molding produced, by a process according to claim 37.

39. The metallized molding according to claim 38, comprising one or more metal layers composed of copper and/or chrome and/or nickel.

40. An electrically conducting component, EMI shielding unit, such as an absorber, attenuator, or reflector for electromagnetic radiation, a gas barrier, or a decorative part, in particular a decorative part in the motor vehicle sector, sanitary sector, toy sector, household sector, or office sector, comprising metallized moldings according to claim 38.

41. A dispersion for the application of a metal layer on a non-electrically-conductive substrate, comprising

a from 0.1 to 99.8% by weight, based on the total weight of components A, B, C, and D, of an organic binder component A,

b from 0.1 to 30% by weight, based on the total weight of components A, B, C, and D, of exfoliated graphite as component B,

c from 0.1 to 70% by weight, based on the total weight of components A, B, C, and D, of electrically conductive particles whose average particle diameter is from 0.01 to 100 μ

m as component C,

d from 0 to 99.7% by weight, based on the total weight of components A, B, C, and D, of a solvent component D, and moreover, if appropriate, at least one of the following components;

e from 0.1 to 20% by weight, based on the total weight of components A, B, C, and D, of a dispersing agent component E, and also

f from 0.1 to 40% by weight, based on the total weight of components A, B, C, and D, of an additive F.

42. The dispersion according to claim 41, wherein the component C used comprises metal powder.

43. A process for the production of a dispersion according to claim 41, comprising the steps of:

a) mixing of components A to C, and at least a portion of component D, and also, if appropriate, of E, and F, and of further components, and

b) dispersion of the mixture.

44. A process for the production of a metal layer on at least a portion of the surface of a non-electrically-conductive substrate, comprising the steps of:

a) at least partial application of a dispersion according to claim 41 to the substrate;

b) at least partial drying and/or partial hardening of the applied dispersion layer on the substrate; and

c) deposition of a metal by a currentless and/or electroplating method on the at least partially dried and/or at least partially hardened dispersion layer, forming a metal layer, where if appropriate, between steps b) and c), a surface of the at least partially dried and/or hardened dispersion layer is activated.

45. A substrate surface, at least partially having an electrically conductive metal layer obtainable from the process according to claim 44.