METHOD FOR SEALING A PHOTONIC DEVICE

• US 20110014731A1
• Filed: 07/15/2009
• Published: 01/20/2011
• Est. Priority Date: 07/15/2009
• Status: Abandoned Application

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Zhang, Lu, Nguyen, Kelvin
• Application Number:
  US12/503,547
• Publication Number:
  US 20110014731A1
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

Methods for sealing a photonic device are disclosed. The photonic device may, for example, comprise a display device, a lighting device or a photovoltaic device. The device is sealed with a glass frit that is heated with a laser from both sides of the device (through both glass substrate plates), either sequentially or simultaneously. The methods can facilitate wider seal widths, and wider overall frit wall widths for increased device strength.

Claims

1. A method of forming a photonic device comprising:

positioning a first glass plate comprising a loop of glass based frit forming a wall over a second glass plate comprising an organic photonically active material disposed thereon;

irradiating a first surface of the wall with a first laser beam through the first glass plate, the first wall surface opposing the first glass plate;

irradiating a second surface of the wall with a second laser beam through the second glass plate, the second wall surface opposing the second glass plate; and

wherein the irradiating the first and second surfaces of the wall couples the first glass plate to the second glass plate, and wherein the second surface comprises a sealed portion and an unsealed portion, and wherein a width of the sealed portion comprises equal to or greater than 80% of the maximum width of the wall.

2. The method according to claim 1, wherein the width of the sealed portion is between 80% and 98% of the maximum width of the wall.

3. The method according to claim 2, wherein irradiating the first surface of the wall and irradiating the second surface of the wall are performed simultaneously.

4. The method according to claim 1, further comprising heating the first glass plate prior to irradiating the first surface.

5. The method according to claim 1, wherein the unsealed portion comprises a pair of unsealed portions positioned on opposite sides of the sealed portion

6. The method according to claim 1, wherein the organic material comprises an organic light emitting diode.

7. The method according to claim 1, wherein the photonic device comprises a photovoltaic device.

8. The method according to claim 1, wherein the photonic device comprises a lighting panel.

9. A method of sealing a glass package comprising:

positioning a first glass plate over a second glass plate, the first glass plate comprising a wall adhered to a surface thereof, the wall comprising a glass sealing material;

irradiating a first surface of the wall with a first laser beam through the first glass plate, the first wall surface adjacent the first glass plate;

irradiating a second surface of the wall with a second laser beam through the second glass plate, the second wall surface adjacent the second glass plate; and

wherein the irradiating the first and second surfaces of the wall couples the first glass plate to the second glass plate, and wherein the second surface comprises a sealed portion and an unsealed portion, and wherein a width of the sealed portion comprises equal to or greater than 80% of the maximum width of the wall.

10. The method according to claim 9, wherein irradiating the first and second wall surfaces is performed sequentially.

11. The method according to claim 9, wherein the irradiating the first and second wall surfaces is performed simultaneously.