METHOD OF CLEANING SUPPORT PLATE

• US 20110017231A1
• Filed: 07/16/2010
• Published: 01/27/2011
• Est. Priority Date: 07/21/2009
• Status: Active Grant

• Current Assignee: AIMECHATEC Ltd. (Hitachi, Ltd.)
• Original Assignee: Tokyo OHKA Kogyo Company Limited
• Inventors: MITAKE, Tatsuhiro, Atsushi, Miyanari, Yoshihiro, Inao
• Granted Patent: US 8,097,087 B2
• Time in Patent Office: Days
• US Class Current: 134/1.1
• CPC Class Codes: B08B 7/0035 by radiant energy, e.g. UV, laser, light beam or the like

Abstract

The present invention achieves a method of cleaning a support plate according to which, while no waste solution is produced after cleaning the support plate, the support plate can be treated at low cost. The method of cleaning the support plate includes the step of removing an organic substance adhered to the support plate by putting the support plate in contact with oxygen plasma.

Claims

1. A method of cleaning a support plate attached, for supporting a substrate, to the substrate being to be thinned, the method comprising the step of:

removing an organic substance adhered to the support plate by putting the support plate in contact with oxygen plasma.

2. The method of cleaning the support plate as set forth in claim 1, wherein:

both sides of the support plate are put in contact with oxygen plasma.

3. The method of cleaning the support plate as set forth in claim 1, wherein:

the support plate is a support plate from which the substrate has been separated.

4. The method of cleaning the support plate as set forth in claim 1, further comprising the step of:

removing metal adhered to the support plate by laser light irradiation onto the support plate.

5. The method of cleaning the support plate as set forth in claim 4, wherein:

the step of removing the metal is performed after the step of removing the organic substance.

6. The method of cleaning the support plate as set forth in claim 4, wherein:

the laser light irradiation is performed onto the support plate from a backside of the support plate, the backside being opposite to a surface of the support plate to which surface the metal adheres.